High Precision Printed Circuit Board Assembly For Tablet Pc, Multilayer Pcb Board / BGA / DIP Assembly
Key Specifications/Special Features:
• Taking IPC-A-160 standard which is the most widely recognized standard of electronic assemblies
• Complicated boards and components available
• Provides OEM services to all sorts of printed circuit board assemblies as well as electronic encased products
• We provide the real vertically integrated OEM service form procurement, plastic tooling/injection,
• Can place 0201 SMD chip , BGA and x-ray ,AOI inspection
• PCB assembly, final casing assembly/testing, quality assurance to shipping
• In-circuit testing capability for PCBAs
• PCBA/SMT/final assembly -vertical integrated manufacturing solution
• Profound knowledge of contract manufacturing services
• Capable of developing effective production process to ensure high quality and consistency
• Experienced logistic control
• Cost-effective factory located in China
• Flexible production for customers' required volumes
• Reliable circuit board available in soldering and casing assembly
• The overall quality of assembled product is guaranteed by the quality of the components made
• Reliable contract assembly service provides optimal flexibility
Our services for the PCB Assembly
- Re-layout for shortening the board size
- Bare pc board fabrication
- SMT/BGA/DIP assembly
- Full component procurement or the substitute components sourcing
- Wire harness and cable assembly
- Metal parts, rubber parts and plastic parts including mold making
- Mechanical, case and rubber molding assembly
- Functional testing
- Repairs and inspection of the sub-finished / finished goods
Our capabilities for the PCB Assembly
|
Stencil Size Range |
736 mm x 736 mm |
|
Min. IC Pitch |
0.30 mm |
|
Max. PCB Size |
410 mm x 360 mm |
|
Min. PCB Thickness |
0.35 mm |
|
Min. Chip Size |
0201 (0.6 mm X 0.3 mm) |
|
Max. BGA Size |
74 mm X 74 mm |
|
BGA Ball Pitch |
1.00 mm (Min) / F3.00 mm (Max) |
|
BGA Ball Diameter |
0.40 mm (Min) /F1.00 mm (Max) |
|
QFP Lead Pitch |
0.38 mm (Min) /F2.54 mm (Max) |
|
Frequency of Stencil Cleaning |
1 time / 5 ~ 10 Pieces |
Our capabilities for handling the Bare PC Board fabrication
Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD
Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
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