Two Layer Electronic Pcb Assembly Service, Fr-4 / Fr-5 / High-Tg PCB Board Assembly with SMT / BGA /

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Two Layer Electronic Pcb Assembly Service, Fr-4 / Fr-5 / High-Tg PCB Board Assembly with SMT / BGA / DIP

 

Our services for the PCB Assembly

  • Full component procurement or the substitute components sourcing
  • Wire harness and cable assembly
  • Metal parts, rubber parts and plastic parts including mold making
  • Re-layout for shortening the board size
  • Bare pc board fabrication
  • SMT/BGA/DIP assembly
  • Mechanical, case and rubber molding assembly
  • Functional testing
  • Repairs and inspection of the sub-finished / finished goods

 

Our capabilities for the PCB Assembly

 

Stencil Size Range

736 mm x 736 mm

Min. IC Pitch

0.30 mm

Max. PCB Size

410 mm x 360 mm

Min. PCB Thickness

0.35 mm

Min. Chip Size

0201 (0.6 mm X 0.3 mm)

Max. BGA Size

74 mm X 74 mm

BGA Ball Pitch

1.00 mm (Min) / F3.00 mm (Max)

BGA Ball Diameter

0.40 mm (Min) /F1.00 mm (Max)

QFP Lead Pitch

0.38 mm (Min) /F2.54 mm (Max)

Frequency of Stencil Cleaning

1 time / 5 ~ 10 Pieces

 

 

Our capabilities for handling the Bare PC Board fabrication

 

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
Impedance Control V-scoring ±10%
Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
Immersion Silver, OSP, Hard Gold( up to 100u”)

  • UL and TS16949: 2002 marks
  • Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
  • Profiling: punching, routing, V-cut and beveling
  • OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided

 

Our manufacturing experience includes, but is not limited to:

 

Note Book fields

CHARGER BOARD

INVERTER

POWER CPU

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Mr. Ken PAN (General Manager)
Tel: 86-755-33100752
Mobile: 86-15012552288
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Contact Method
Fortune Mount International Ltd
3rd floor,Building 2,Jianghao Technology Zone, No. 438 Jihua Road, Bantian town , Longgng District, Shenzhen, Guangdong, China (Mainland) / 518000
Fax: 86-86549315
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