Multilayer FR-4 PCB Assembly For Industrial Control, One Stop Printed Circuit Board Assembly Service
Key Specifications/Special Features:
- Our manufacturing facilities include clean workshops and high speed advanced SMT lines
- Our placement precision can reach chip +0.1mm on integrated circuit parts, which means we can almost deal with all kinds of integrated circuits such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
- Additionally, we can provide 0201 chip placement, through-hole components insertion and finished products fabrication, testing and package
- Production of customer designed components
- SMD assembly and through-hole components insertion
- IC preprogramming
- Function verification and burn in testing
- Complete unit assembly (which including plastics, metal box, coil, cable inside and more)
- Environmental coating
- Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure
- Packaging design
- We are committed to improving our product quality constantly
- The products delivered from us shall be full quality checked, striving to 100% customer's satisfaction is our long term mission
- To work with a reliable EMS provider with high mixed, low volume order, contact us today
Our services for the PCB Assembly
- Re-layout for shortening the board size
- Bare pc board fabrication
- SMT/BGA/DIP assembly
- Full component procurement or the substitute components sourcing
- Wire harness and cable assembly
- Metal parts, rubber parts and plastic parts including mold making
- Mechanical, case and rubber molding assembly
- Functional testing
- Repairs and inspection of the sub-finished / finished goods
Our capabilities for the PCB Assembly
Stencil Size Range |
736 mm x 736 mm |
Min. IC Pitch |
0.30 mm |
Max. PCB Size |
410 mm x 360 mm |
Min. PCB Thickness |
0.35 mm |
Min. Chip Size |
0201 (0.6 mm X 0.3 mm) |
Max. BGA Size |
74 mm X 74 mm |
BGA Ball Pitch |
1.00 mm (Min) / F3.00 mm (Max) |
BGA Ball Diameter |
0.40 mm (Min) /F1.00 mm (Max) |
QFP Lead Pitch |
0.38 mm (Min) /F2.54 mm (Max) |
Frequency of Stencil Cleaning |
1 time / 5 ~ 10 Pieces |
Our manufacturing experience includes, but is not limited to:
Note Book fields |
CHARGER BOARD |
INVERTER |
POWER CPU |
LVDS CARD |
IR BOARD |
LCD MOTHERBOARD |
LED BOARD |
RAM CARD |
DATA BOARD |
BATT BOARD |
|
DVR MOTHERBOARD |
USB BOARD |
CARD READER |
AUDIO BOARD |
ISDN MODEN |
|
PC fields |
2.5 inch HDD |
PC/MAC FDD |
DOCKING |
PORT REPILICATOR |
PCMCIA CARD |
3.5 inch HDD |
SATA HDD |
ADAPTER |
DVD ROM |
SSD |
|
Telecom fields |
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