OEM service electronic mobile phone motherboard

Price: 0.1~1.0 USD
Payment Terms: T/T,WU;Paypal
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Basic Info.
  • Brand Name: TWS 
  • Base Material: FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,Aluminum material 
  • Copper Thickness: 0.5-4.0oz 
  • Board Thickness: 0.2mm-7mm 
  • Min. Hole Diameter: 0.25mm 
  • Min. Line Width: 0.075mm(3mil) 
  • Min. Line Spacing: 0.075mm(3mil) 
  • Surface Finishing: HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating 
  • Layer: 1-28 Layer 
  • Solder Mask: green/red/blue/white/yellow 
  • MAX.Board Size: 9200*900mm 
  • Certification: UL/SGS/ROHS 
  • Controlled impedance: ±5% 
  • Warp&Twist: 0.7% 
  • Rang of finish boards thickness: 0.21~7.0mm 
  • Impedance control: ±10% 
  • OEM/ODM: One-stop service 
  • PCB standard: IPC-A-610D 
  • Model No.: TWS-07BJ 
  • Place of Origin: Guangdong  
  • Min.Order: 5 Piece/Pieces
  • Means of Transport: Ocean, Air, Land
Supply Capacity
  • Production Capacity: 120000 Square Meter /Month
  • Packing:vacuum packaging and carton box
  • Delivery Date: 5-15 Days
electronic mobile phone motherboard
1.PCB manufacturing
2.PCB PCB manufacturing
2.PCB assembly & design
3.Circuit board parts
4.Electronic components purchasing
5.PCB assembly OEM



1.PCB Specification detail.
NO
ITEM
Technical Data
1
Layer
2-20
Layers
2
Board
material
FR4,FR4
Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base
3
Max.Board
Size0
457*660mm
4
Min.Board Thickness
2 layers 0.2mm
4 layers 0.4mm
6 layers 0.8mm
8 layers 1.0mm
10 layers 1.2mm
5
Max.Board
Thickness
8.0mm
6
Min.Line
Width
0.05mm
7
Min.Line
Space
0.05mm
8
Min.Hole Size0
Electroplating
Via 0.15mm
Micro via 0.075mm
9
PTH
Wall Thickness)
20-25um
10
Max.finish
copper thickness0
8OZ
11
PTH
Dia.Tolerance
±0.05mm
12
NPTH
Dia.Tolerance
±0.025mm
13
Hole
Position Deviation
±0.05mm
14
Outline
Tolerance
±0.1mm
15
Min.S/M
Pitch
0.08mm
16
Insulation
Resistance
3x10Sec,
288°C
17
Warp
and Twist
≤0.7%
18
Electric
Strength
>1.3KV/mm
19
Peel
Strength
≥1.4N/mm
20
Solder
Mask Abrasion
≥6H
21
Flammability
94V0
22
Impedance
Control
±5%


2.Details
for PCB Assembly
Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT  technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test)  technology;
4).Nitrogen gas reflow soldering  technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.

Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
3).PCBA Test method.

Quality
Our UL/Rohs standards insure quality assemblies from start to finish. Whether it's a simple custom product or a complex turnkey production run, TWS will adhere to the highest quality standards.

Capable
TWS offers the latest in assembly capabilities and qualifications insuring that quality is built into every product we produce.

Experience
When it comes to your build you want a partner you can depend on. Our management team has over 10years of combined industry knowledge. Our engineering team has over 8 years experience.

Protecting your interests
Protecting your Intellectual Property is job one! Our staff colleague of trained professionals are all working under a strict confidentiality contract and treat your important documentation as they would their own.

Flexibility
TWS pride ourselves on our ability to custom tailor programs around our customers' needs. We take time to listen to your unique business needs and then set out to surpass them.





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ELECTRONIC MOBILE PHONE MOTHERBOARD

Send message to this supplier
Ms. Grace
Tel: 86-755-29087997
Mobile: 13510820959
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Contact Method
Shenzhen Tianweisheng Electronic Co., Ltd.
4F, No. 48 Bldg., Gongle Ind. Zone, Xixiang Street, Bao' an District, Shenzhen, Guangdong, China (Mainland)
Fax: 86-755-29667579
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