Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
Details for PCB Assembly
1.Technical
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
2.Quote requirement
1).The detailed files(Gerber files,specification and BOM);
2).Clear pictures of PCBA or samples for us;
