BGA encapsulate pcb assembly 4 layer pcb multilayer circuit board SGS , RoHS

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BGA encapsulate pcb assembly 4 layer pcb multilayer circuit board SGS , RoHS

 

Specifications

 
BGA encapsulate pcb assembly
1.PCB&PCBA assembly services
2.Approval: ISO9001:2008 ,SGS,RoHS
3.Fast Lead Time and Delivery


 

Your Best Choice for Printed Circuit Board Manufacturing & Assembly

 

OEM/ODM/EMS Services for PCBA:

  • PCBA, PCB Board assembly: SMT & PTH & BGA
  • PCBA and enclosure design
  • Components sourcing and purchasing
  • Quick prototyping
  • Plastic injection molding
  • Metal sheet stamping
  • Final assembly
  • Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
  • Custom clearance for material importing and product exporting

 

Capability - SMT

  • Lines                   9(5 Yamaha,4KME)
  • Capacity                 52 million placements per month
  • Max Board Size           457*356mm.(18”X14”)
  • Min Component size       0201-54 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP
  • Speed                   0.15 sec/chip,0.7 sec/QFP

 

Capability - PTH

  • Lines                   2
  • Max board width         400 mm
  • Type                   Dual wave
  • Pbs status               Lead-free line support
  • Max temp               399 degree C
  • Spray flux               add-on
  • Pre-heat                 3

 

Technical Data:

 

Stencil size/range:

736x736mm

Minimum IC pitch:

0.30mm

Maximum PCB size:

1200x 500mm

Minimum PCB thickness:

0.35mm

Minimum chip size:

0201 (0.2x0.1)/0603 (0.6 x 0.3mm)

Maximum BGA size:

74x74mm

BGA ball pitch:

1.00mm (minimum), 3.00mm (maximum)

BGA ball diameter:

0.40mm (minimum), 1.00mm (maximum)

QFP lead pitch:

0.38mm (minimum), 2.54mm (maximum)

Frequency of stencil cleaning:

1 time/5 to 10 pieces

 

Turn Times:

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Shenzhen XingdaYun Technology Co., Ltd.
Floor 5 Area A Of Floor 3 Building A Area B Northern Yanchuan Industrial Zone, Songgang Town, Baoan Dist., Shenzhen, Guangdong, China (Mainland)
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