Electronic FR4 circuit board with OSP surface finishing for mainboard computer
Specifications
a). Impressive Quality
b). Fast Lead Time
c). Good Servic
FR4 Electronic circuit board for mainboard computer
Capability of PCB Manufacturing
Process Capability | ||
ltem | Mass Production | Prototype |
Surface Treatment | HASL(LF) | HASL(LF) |
Immersion Gold | Immersion Gold | |
Flash Gold | Flash Gold | |
OSP | OSP | |
Immersion Tin | Immersion Tin | |
Immersion Silver | Immersion Silver | |
HASL&Gold Finger | HASL&Gold Finger | |
selective nickel | selective nickel | |
HASL(LF) | smt Pad:>3um | smt Pad:>4um |
Big Cu:>lum | Big Cu:>l.5um | |
Immersion Tin | 0.4-0.8um | 0.8-1.2um |
Immersion Gold | Ni:2-5urn | Ni:3-6urn |
Au:0.05-0.10um | Au:0.075-0.15um | |
Immersion Silver | 0.2-0.6um | 0.3-0.6um |
OSP | 0.1-0.4um | 0.25-0.4um |
Flash Gold | Ni:3-6urn | Ni:3-6urn |
Au:0.01-0.05um | Au:0.02-0.075um | |
Laminates | CEM-3,PTFE | CEM-3,PTFE |
FR4 (HighTG etc) | FR4(HighTG etc) | |
Metal Base(AL,CUetc) | Metal Base(AL,CUetc) | |
Rogors,etc | Rogors,etc | |
MAX.Layers | 12(Layers) | 40(Layers) |
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