4-Layer rigid flex pcb for cell phone pcb Green / Blue Solder mask ENIG finish

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4-Layer rigid flex pcb for cell phone pcb Green / Blue Solder mask ENIG  finish

 

Quick Details

 

Place of Origin: China (Mainland) Brand Name: OEM Model Number: H015K
Number of Layers: 4-Layer Base Material: PI Copper Thickness: 1OZ
Board Thickness: 1.6mm Min. Hole Size: 0.2mm Min. Line Width: 0.1mm
Min. Line Spacing: 0.1mm Surface Finishing: ENIG Solder mask:
Green/Blue/Black/White/Yellow/Red etc
Max size of finish board: 9200*900mm Certification: UL/SGS/ROHS Controlled impedance: ±5%
Warp&Twist: 0.7% Rang of finish boards thickness: 0.21~7.0mm Layer count: 1~28
Impedance control: ±10% OEM/ODM: One-stop service PCB standard: IPC-A-610D

 

Specifications

 

rigid flex pcb
a.PCB OEM&ODM Clone/Copy
b.PCB Design
c.Turnkey service
d.UL,SGS,RoSH,TS

 

rigid flex pcb

 

1.ENIG  finish required to meet ROHS compliant;

2.PI material within 0.2mm-3.2mm boards thickness;

3.Copper weight:0.5OZ,1OZ,2OZ,3OZ;

4.0.2mm min finished hole size;

5.Certificate: UL, ROHS, T/S16949;
6.Company management: ISO9001:2000;
7.Markets: Europe, America, Asia etc all over the world.

 

PCB manufacturing capacity

 

NO 

         Item

 Craft Capacity

1               

Layer                                                  

1-28 Layers                                                                                

2

Base Material for PCB

FR4, CEM-1, TACONIC, Aluminium, 

High Tg Material, High Frequence ROGERS ,

TEFLON, ARLON, Halogen-free Material

3

Rang of finish baords Thickness

0.21-7.0mm

4

Max size of finish board

900MM*900MM

5

Minimum Linewidth

3mil (0.075mm)

6

Minimum Line space

3mil (0.075mm)

7

Min space between pad to pad

3mil (0.075mm)

8

Minimum hole diameter

0.10 mm

9

Min bonding pad diameter

10mil

10

Max proportion of drilling hole and board thickness

1:12.5

11

Minimum linewidth of Idents

4mil

12

Min Height of Idents

25mil

13

Finishing Treatment

HASL (Tin-Lead Free),  ENIG(Immersion Gold),

 Immersion Silver , Gold Plating 

(Flash Gold), OSP, etc.

14

Soldermask

Green, White, Red, Yellow, Black, Blue, 

transparent photosensitive soldermask, 

Strippable soldermask.

15

Minimun thickness of soldermask

10um

16

Color of silk-screen

White, Black, Yellow ect.

17

E-Testing

100% E-Testing (High Voltage Testing); 

 Flying Probe Testing 

18

Other test

ImpedanceTesting,Resistance Testing, 

Microsection etc.,

19

Date file format

GERBER FILE and DRILLING FILE, 

PROTEL SERIES, PADS2000 SERIES, 

Powerpcb SERIES, ODB++

20

Special technological requirement

Blind & Buried Vias and High Thickness copper

21

Thickness of Copper

0.5-14oz (18-490um)

 


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Mr. Li
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Shen Zhen Hongfu Hua Technology Co., Ltd.
Guanlan Subdist., Baoan District,, Shenzhen, Guangdong, China (Mainland)
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