Multi Layer DIP CSP Printed Circuit Board Assemblies For MP4 0.3 mm Thickness

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Multi Layer DIP CSP Printed Circuit Board AssembliesFor MP4 0.3 mm Thickness

 

Characteristics:

1. Professional PCB manufacturer.

2. PCBA,OEM,ODM service are provided.

3. Gerber file needed.

4. Products are 100% E-tested.

5. Quality guarantee and professional after-sale service.

 

 

Key Specifications/Special Features

1

We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed.

2

All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP,  QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts.

3

We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging.

4

SMT/SMD assembly and through-hole components insertion

5

IC preprogramming

6

Function verification and burn in testing

7

Complete unit assembly (which including plastics, metal box, coil, cable inside and more)

8

Environmental coating

9

Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure

10

Packaging design and production of customized PCBA

11

100% quality assurance

12

High mixed, low volume order is also welcomed.

13

Full component procurement or the substitute components sourcing

14

UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant

 

 

 

3.PCB Assembly process capability

 

PRODUCTION CAPABILITY OF PCB ASSEMBLY

Stencil Size Range

 756 mm x 756 mm

Min. IC Pitch

 0.30 mm

Max. PCB Size

 560 mm x 650 mm

Min. PCB Thickness

 0.30 mm

Min. Chip Size

 0201 (0.6 mm X 0.3 mm)

Max. BGA Size

 74 mm X 74 mm

BGA Ball Pitch

 1.00 mm (Min) / F3.00 mm (Max)

BGA Bal

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Mr. Bryant
Tel: 86-751-29928869
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Shenzhen SYF Precision Electronics limited company
Room801-805,7/Floor,Dehe Building,Shajing Town,Bao'an District, Shaoguan, Guangdong, China (Mainland)
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