Specification:
CCL thickness:0.6mm,0.8mm,1.0mm,1.2mm,1.6mm,2.0mm,2.5mm,3.0mm,4.0mm
Thermal conductivity:1.0W/m.k,1.5W/m.k,2.0W/m.k,3.0W/m.k
Dielectric thickness:80um-150um
Copper foil:1OZ,2OZ,3OZ
Supply size:500*600mm/400*1200mm/500*1200mm/600*1200mm,We can supply other size upon request.
Item No. : AL-H-06
Feature:
Meet the RoHS requirements
Excellent thermal conductivity
Solder excellent performance
Outstanding reliability
Good machinability
Excellent dimensional stability
Electromagnetic wave shielding
Application:
Copper clad laminate is the electronic industrial base material, mainly used for the manufacture
of printed circuit board (PCB), widely applied in television, radio, computer, mobile communications
and other electronic products.
Note:
We supply Copper Clad Laminate size of 400*1200 mm,500*600 mm,500*1200 mm,
600*1000 mm,600*1200 mm as standard,adjust the price according to the utilization of special size.
We supply Copper Clad Laminate thickness of 0.8 mm,1.0 mm, 1.2 mm, 1.6 mm,2.0 mm,2.5 mm,
3.0 mm and 4.0 mm all with copper foil thickness 1OZ as a standard. We can supply other copper
thickness upon request.The error of Copper Clad Laminate thickness within plus or minus 0.1 mm.
We supply Copper Clad Laminate thickness with copper foil thickness 1 OZ as a standard,
other copper foil base on 1 OZ to plus 5$ per square meter,and so on.
AL Base Copper Clad Laminate can be supplied with Heat Transfer Rate 1.0 W/m.k ,
1.5 W/m.k, 2.0 W/m/k,3 W/m.k are available.
