Specification:
Thermal conductivity: 3.0 W/m.k
Dielectric Layer thickness: 75µm ~350µm
Release film thickness: 45µm ~ 50µm
Max width: 1220mm, length are available upon request
Feature:
Excellent ductibility
Low thermal resistance
Squeeze-out less
High electric resistance stability
Application:
Metal Base Copper Clad Laminate,Multilayer PCB,Power Converters, LED backlight, LED Photoelectric Lighting, High-frequency Power Supply Unit.