4 Layer FR4 Multi Layer PCB UL Marked RED Solder Mask for Power Supplier

PCB Descriptions

 Basic Material

 High Tg-180 FR4

 Board Thickness

 2.0 mm

 Layer Count

 4-Layer

 Copper Thickness

 1.0 oz

 Surface Finish

 LEAD FREE HASL 

 Solder Mask

 RED

 Silkscreen

 White

 Trace Spacing

 0.030/0.030mm

 Hole Size

 0.25mm

 Hole Copper Thickness

 ≥20μm

 Measurement

 64×42mm

 Packing

 Outer: Cardboard Cartons with double straps

 Inner: Vacuum-packed in soft plastic bales  

 Certificates

 UL,ISO9001:2008,ROHS,REACH,SGS

 Advantage

 OEM&ODM,Competitive Price,Fast Delivery,

 Special Requirements

 Buried And Blind Via, Impedance Control, Via Plug, 
 BGA Soldering And Gold Finger Are Acceptable

 Applications

 Communication,automobile,cell,computer,medical

 PRODUCTION OF PCB PRINTED CIRCUIT BOARD

 Engineering Process

 Items

 Production Capability

 Laminate Board

 Board Thickness

 0.23.2mm

 Product Type

 Layers

 2L-16L

 Lamination

 Max. Panel size

 500×600mm

 Layers Inside

 Core Thickness inside

 0.12.0mm

 Internal Tracing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Dimension Tolerance

 Board Thickness Tolerance  

 ±10%

 Inter layer Alignment

 ±3mil

 Drilling Tolerance

 Panel Measurement

 Max: 660×600mm

 Drilling Dimension

 0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 20um

 Uniformity

 90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

 Min: 0.08mm

 Plating Pattern 

 Finished Copper Thickness

 1oz2oz

 EING/Flash Gold

 Nickel Thickness

 2.5um~5.0um

 Gold Thickness