Aluminum Solder Mask Multi Layer PCB ENIG Surface Finish , 4 Layer PCB
PRODUCT’S DETAILS |
|
Raw Material |
FR-4 (Tg 180 available) |
Layer Count |
4-Layer |
Board Thickness |
1.6mm |
Copper Thickness |
2.0oz |
Surface Finish |
ENIG |
Solder Mask |
Green |
Silkscreen |
White |
Min. Trace Width/Spacing |
0.075/0.075mm |
Min. Hole Size |
0.25mm |
Hole Wall Copper Thickness |
≥20μm |
Measurement |
300×400mm |
Packaging |
Inner: Vacuum-packed in soft plastic bales |
Application |
Communication,automobile,cell,computer,medical |
Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PRODUCTION CAPABILITY OF PCB |
||
|
ITEMS Ite |
PRODUCTION CAPABILITY Manufacturing Capability |
Laminate |
Type |
FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, |
Thickness |
0.23.2mm |
|
Production Type |
Layer Count |
2L-16L |
Surface Treatment |
HAL,Gold Plating,Immersion Gold,OSP, |
|
Cut Lamination |
|