Black Core FR4 Multilayer PCB Board with Transparent Solder Mask
Key Specifications/Special Features
| Number. of Layers: | 4 |
| Laminate Material: | FR4 |
| Surface Finish: | HASL |
| Copper Thickness: | 1 oz |
| Board Thickness: | 1.6mm |
| Board Size: | |
| Color of Mask: | Transparent |
| Color of Silkscreen: | White |
| Flammability: | UL 94V-0 |
| Workmanship: | Compliance with IPC-A-600 & IPC-6012 CLASS II |
| Thermal Conductivity | - |
Advantage
1. Factory directly
2. Comprehensive quality control system
3. Competitive price
4. Quick turn: delivery time from 48hours.
5. Certification (ISO/UL E354810/ RoHS)
6. 8 years experience in exporting service
7. No MOQ/MOV.
8. High quality. Strict through the AOI (Automated Optical Inspection), QA/QC, flying probe, E-testing, etc.
Product Application
PCBs are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries
Capacity
| High precision prototype | PCB bulk production | ||
| Max Layers | 1-28 layers | 1-14 layers | |
| MIN Line width(mil) | 3mil | 4mil | |
| MIN Line space(mil) | 3mil | 4mil | |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
| Board thickness≤2.5mm | 0.2mm | 0.3mm | |
| Board thickness2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Board thickness | MAX | 8mm | 7mm |
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
| MAX Board size | 610*1200mm | 610*1200mm | |
| Max copper thickness | 0.5-6oz | 0.5-6oz | |
|
Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” |
||
| Hole copper thick | 25um 1mil | 25um 1mil | |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
| Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
|
| Impedance | ±10% | ±10% | |
| MIN Solder mask bridge | 0.08mm | 0.10mm | |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |
