FR4 Custom PCB Boards 4 Layer HASL High Current Power Supply UL Certificate

 PRODUCTION OF PCB PRINTED CIRCUIT BOARD

 Engineering Process

 Items

 Production Capability

 Laminate Board

 Board Thickness

 0.23.2mm

 Product Type

 Layers

 2L-16L

 Lamination

 Max. Panel size

 500×600mm

 Layers Inside

 Core Thickness inside

 0.12.0mm

 Internal Tracing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Dimension Tolerance

 Board Thickness Tolerance  

 ±10%

 Inter layer Alignment

 ±3mil

 Drilling Tolerance

 Panel Measurement

 Max: 660×600mm

 Drilling Dimension

 0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 20um

 Uniformity

 90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

 Min: 0.08mm

 Plating Pattern 

 Finished Copper Thickness

 1oz2oz

 EING/Flash Gold

 Nickel Thickness

 2.5um~5.0um

 Gold Thickness

 0.03~0.05um

 Solder Mask

 Thickness

 1535um

 Solder Mask Bridge

 3mil

 Length

 Line width/Line spacing

 6/6mil

 ENIG

 Nickel Thickness

 120u

 Gold Thickness

 150u

 Beveling

 Beveling Dimension

 30300mm

 Routing

 Tolerance of Dimension

 ±0.1mm

 Slot Size

 Min:0.4mm

 Cutter Diameter

 0.82.4mm

 Punching

 Outline Tolerance

 ±0.1mm

 Slot Size

 Min:0.5mm

 V-CUT

 V-CUT Dimension

 Min:60mm

 Angle

 15° 30° 45°

 Remain Thickness Tolerance

 ±0.1mm

 Hot Air Level

 Tin Thickness

 100300u

 Test

 Testing Voltage

 250V

 Max.Dimension

 680×600mm

 Impedance Control

 Tolerance

 ±10%

 Aspect Ration

 12:1

 Laser Drilling Size

 4mil(0.1mm)