LD-MK-UV3003 Diode end-pumped UV Laser Marking Machine
Applied materials: Brittleness material like fire-proof material, glass, ceramics, monocrystalline
silicon and polycrystalline silicon etc. Special material like small Flexible Printed Circuit etc
Applied Industries: It can be applied for precision marking, micro-processing and cold
processing in micro-electronics industry. Marking, scribing, carving, cutting and surface
processing on various type of chips, flexible printed circuit board, ultra-thin glass, LCD screen,
textile, sheet ceramic, semiconductor wafer, IC grain, sapphire, polymeric film, brittleness
material and Special plastic packaging etc.
Features :
1. Adopt high quality UV laser source, wave length is 355nm
2. Compare with normal laser marking machine, the focused spot of UV laser is smaller and
marking result is better precision. It has incomparable advantage than other laser machines for
applied precision marking, precision cutting and micro processing on the special materials.
3. It suitable for precision micro machining, cold processing. Compare with infrared diode
pumped machine, it has higher absorption rate of metal, monocrystalline silicon, polycrystalline
silicon, industrial ceramics, glass etc, can used for marking, cutting, scribing and cutting for small
Flexible Printed Circuit.
Parameter:
Laser Medium ND:YVO4
Laser wavelength 355nm
Average Output Power ≥3W@30KHZ
Power Supply AC220V±15% 50Hz
