High Density Rogers PCB Ro5880 High Frequency Material Printed Circuit Board
Specification
|
PCB Type: |
Rogers PCB |
|
Layer : |
6 layer |
|
Min .Line Width/Space: |
3mil/3mil |
|
Min. Via Diameter: |
0.3mm |
|
Finish Thickness: |
0.2mm |
|
Surface Finish: |
ENIG |
|
Size: |
90*90MM |
|
Material: |
5880 |
|
Color: |
golden |
|
Application: |
aerospace |
Parameter
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | 1012Ωnormal | ||||||||
| Through-hole resistance | 300Ωnormal | ||||||||
| Electric strength | 1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | 6H | ||||||||
| Thermal stress | 28820Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
Description:
A dielectric material is a substance that is a poor conductor of electricity, and used as an insulating layer in the PCB build up. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss, (the proportion of energy lost as heat) the more effective the dielectric material. If the voltage across a dielectric material becomes too great -- that is, if the electrostatic field becomes too intense -- the material will suddenly begin to conduct current. This phenomenon is called dielectric breakdown.
Our high density circuit boards have the technology pushing capabilities to drive applications in a large number of industries including but not limited to semiconductor test equipment, defense, medical and aerospace.
