2+6+2 Stack Up Impedance HDI Multilayer PCB FR4 With Rogers Mixed Compression
Specification:
Type: 2+6+2 Stack up Impedance HDI
Material:
Layer Count: 10
Finish Thickness: 1.2+8%mm
Min. Via dia: 0.2mm
Surface Finish: ENIG+Hard Gold Plating
Specialty:
L1-2, L2-3, L8-9, L9-10: Resin fill, laser blind via of 0.1mm; L3-8: Buried via and resin filled.
Parameter:
| PCB parameter | |||||||||
| Max panel size | 508*610mm | ||||||||
| Board thickness tolerance | T≥0.8mm±8%,T0.8mm±5% | ||||||||
| Wall hole copper thickness | 0.025mm(1mil) | ||||||||
| Finished hole | 0.2mm-6.3mm | ||||||||
| Min line width | 4mil/4mil(0.1/0.1mm) | ||||||||
| Min bonding pad space | 0.1mm(4mil) | ||||||||
| PTH aperture tolerance | ±0.075mm(3mil) | ||||||||
| NPTH aperture tolerance | ±0.05mm(2mil) | ||||||||
| Hole site deviation | ±0.05mm(2mil) | ||||||||
| Profile tolerance | ±0.10mm(4mil) | ||||||||
| Board bend&warp | ≤0.7% | ||||||||
| Insulation resistance | 1012Ωnormal | ||||||||
| Through-hole resistance | 300Ωnormal | ||||||||
| Electric strength | 1.3kv/mm | ||||||||
| Current breakdown | 10A | ||||||||
| Peel strength | 1.4N/mm | ||||||||
| Soldmask regidity | 6H | ||||||||
| Thermal stress | 28820Sec | ||||||||
| Testing voltage | 50-300v | ||||||||
| Min buried blind via | 0.2mm(8mil) | ||||||||
| Outer cooper thickness | 1oz-5oz | ||||||||
| Inner cooper thickness | 1/2 oz-4oz | ||||||||
| Aspect ratio | 8:1 | ||||||||
| SMT min green oil width | 0.08mm | ||||||||
| Min green oil open window | 0.05mm | ||||||||
| Insulation layer thickness | 0.075mm-5mm | ||||||||
| Aperture | 0.2mm-0.6mm | ||||||||
| Special technology | Inpedance,blind buried via,thick gold,aluminumPCB | ||||||||
| Surface finish | HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating | ||||||||
