-40 - 200 LED Lighting Thermal Conductive Glue with Two Component Fire Resistant Silica Encapsulan

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-40 - 200 LED Lighting Thermal Conductive Glue with Two Component Fire Resistant Silica Encapsulant

 

 

TIS™ 680-28AB is a two-component, high thermal conductive, low temperature cured, long pot life, fire resistant Silica encapsulant glue. It is design for potting of capacitors and electrical devices.Their flexibility and elasticity make them suited to the coating of the very uneven surfaces. Heat can transmit to the metal housing or dissipation plate from the separate elements or even the entire PCB, which in effect enhances the efficiency and life-time of the heat-generating electronic components.

 

Features

 

> Good thermal conductive: 2.8W/mK
> Excellent insulation and smoothly sourface.
> Low shrinkage
> Low viscosity, expediting air releaseed.
> Excellent in solvents and water proof. 
> Longer life time.
> Excellent thermal shock efficiecy and impact resistance

 

Application  

 

> To potting LED Lighting heat spreader and  power- driver.
> Ferrite cements; tip type LED; good cementation to aromatic polyester 
> Relay sealant; Good adhesion to rubber, ceramics,  PCB and plastics 
> Power transformers and coils; Potting capacitors;  Potting of small electrical devices 
> Adhesion to metal glass and plastic; LCD & substrates adhesion; Coating and sealant;  Coil ; IGBTS; Transformer; Fire retardant 
> Optical / medical component adhesive

 

 

 

Typical Uncured Material   TIS™ 680-28A (Resin)  
Color  White
Viscosity@25 Brookfield  6,000 cPs 
Specific Gravity  12.2g/cc
Shelf life @25 in sealed container  12 months 

 

 

TIS™ 680-28B (Hardener)
Color  White
Viscosity@25 Brookfield  6,000 cPs 
Shelf life @25 in sealed container  12 months

 

 

                                                                                                      Mix Ratio (By weight) 
TIS™ 680-28A : TIS™ 680-28B = 100 : 100  
Viscosity @25 6000 cPs
Working pot life (250 g @25)  30 min
Specific Gravity  2.2 g/ccn 

 

 

Cure Schedule  
Cure 3 hours at 25
Cure 20 min at 70

 

 

Cured Properties 
Hardness @25 85 Shore D 
Service temperature -40 to +200
Glass transition temperature Tg   92
Elongation 4.50%
Coefficient of thermal expansion, / 3.0 x 10-5
Fire resistance UL 94 V-0
Moisture absorption % wt gain 24 hours water immersion @25 < 0.1

 

 

Thermal
Thermal Conductivity  2.8 W/m-K
Thermal Impedan
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Dongguan Ziitek Electronic Materials & Technology Ltd.
Building B8, Industry District, Dongguan, Guangdong, China (Mainland)
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