Void Free Surface Thermal Conductive Adhesive 1.3W / mK for Power Modules / IGBT / Computer
TIS™580-13 Series is dealcoholized, 1 component, room temperature cure thermally conductive silicone adhesive. It possesses good heat conduction and adhesion towards electronic components. It can be cured to a higher hardness elastomer, leads to firmly attached to substrates resulting lower down thermal impedance. Thus, heat transfer among heat source, heat-sink, motherboard, metal casing will become effective. TIS™580-13 Series possesses high thermal conductivity, excellent electrical insulation and is ready-to-use. TIS™580-13 Series has excellent adhesion to copper, aluminium, stainless-steel, etc. As this is a dealcoholized system, it will not corrode, especially, metal surfaces.
Feature
> Good thermal conductivity: 1.3W/mK
> Good maneuverability and good adhesion
> Low shrinkage
> Low viscosity, leads to void-free surface
> Good solvent resistance, water resistance
> Longer working life
> Excellent thermal shock resistance
| Typical values of TISTM580-13 | ||
| Appearance | White paste | Test Method |
| Density(g/cm3,25) | 1.3 | ASTM D297 |
| Tack-free time(min,25) | ≤20 | ***** |
| Cure type(1-component) | Dealcoholized | ***** |
| Viscosity@25 Brookfield (Uncured) | 20K cps | ASTM D1084 |
| Total cure time(d, 25) | 3-7 | ***** |
| Elongation(%) | ≥150 | ASTM D412 |
| Hardness(Shore A) | 25 | ASTM D2240 |
| Lap Shear Strength(MPa) | ≥2.0 | ASTM D1876 |
| Peel Strength(N/mm) | 3.5 | ASTM D1876 |
| Operation temperature() | -60250 | ***** |
| Volume Resistivity(Ω·cm) | 2.0×1016 | ASTM D257 |
| Dielectric Strength(KV/mm) | 21 | ASTM D149 |
| Dielectric Constant (1.2MHz) | 2.9 | ASTM D150 |
| Thermal Conductivity W/(m·K) | 1.3 | ASTM D5470 |
