Surface Treated RA Copper Foil With High Peel Strength Especially For FPC Use
Applications:
Flexible Copper Clad Laminate(FCCL), Fine Circuit FPC, LED coated crystal thin film.
Dimension Range:
- Copper Foil thickness from 12~100µm can be supplied for FPC.
- Width can be made according to clients’ requirement up to 600mm.
Performances:
- High flexibility and extensibility
- Even and smooth surface
- Good fatigue resistance
- Strong antioxidant properties
- Good mechanical properties
Features:
The material has higher extensibility, and has a high bending resistance and no crack.
Name |
GB |
ALLOY NO. |
SIZE (mm) |
||||
(ISO) |
(ASMT) |
(JIS) |
(BIS) |
(DIN) |
|||
Copper Foil |
T2 |
Cu-ETP |
C11000 |
C1100 |
C101 |
R-Cu57 |
Thickness: 0.006-0.1 /Max Width: 650 |
Item |
Unit |
Parameters |
|||||
12μm |
18μm |
25μm |
35μm |
70μm |
|||
Mass per unit(±5%) |
g/m² |
105 |
160 |
300 |
400 |
445 |
|
Cu+Ag |
% |
≥99.99 |
|||||
Temper |
|
H |
O,H |
O,H |
O,H |
O,H |
|
Surface roughness |
Ra |
μm |
0.13 |
0.12 |
0.1 |
0.08 |
0.08 |
Rz |
μm |
1.3 |
1.0 |
0.8 |
0.74 |
0.76 |
|
|
High Temp /220 |
N/mm² |
≥140 |
≥150 |
≥170 |
≥210 |
≥220 |
Elongation |
Normal Temp /23 |
% |
≥1.5 |
≥3.0 |
≥4.0 |
≥4.2 |
≥4.5 |
High Temp /220 |
% |
≥8 |
≥10 |
≥18 |
≥28 |
≥30 |
|
Fatigue Resistance (annealed) |
% |
65 |
65 |
65 |
65 |
65 |
|
Maximum resistivity |
Ωmm2/m |
0.0181 |
|||||
Electrical conductivity |
% |
≥98.3% |
|||||
Film and adhesive layers |
Instant Temp. 300/10s |
Film and adhesive paste after transient
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