Phone Mobile Circuit Board PCB Assembly Services with LCD Display

ITEM

Parameter

Layer count

1-16 layers

Material

fr4,Tg=135,150,170,180,210,cem-3,cem-1,al base, teflon, rogers, nelco

Copper thickness

1/2oz,1oz,2oz,3oz,4oz,5oz

Board thickness

8-236mil(0.2-6.0mm)

Max. panel size

32"X20"(800X508mm)

Min. line width/space

3/3 mil(75/75um)

Min. inner layer annular ring

4 mil(0.10mm)

Min. core thickness

4 mil(0.10mm)

Surface treating of inner layer

brown oxide

Inner layer ragistration

3 mil(76um)

Tolerance of board thickness

+/- 12-10 %

Min. drill size

8 mil(0.2mm)

Min. HDI laser drill size

3 mil(0.067mm)

Tolerance of hole size

2 mil(0.05mm)

Tolerance of hole position

2 mil(0.05mm)

Max. aspect ratio

10:01

PTH copper thickness

1 mil(25 um)

Solder mask color

Green, blue, yellow, white, black, red

Solder mask thickness

5-30um

Solder mask hardness

6H

Min. solder mask dam

3 mil(75um)

Max. hole size of S/M plug

24um(0.6mm)

Peelable solder mask

yes

carbon ink

yes

surface treating

HASL(ROHS), ENING,OSP,IMMERSION SILVER,IMMERSION TIN,flash gold,gold finger