Home > Computers & Consumer Electronics > Antenna & Remote Control > LB-73 material 3.2mm thickness Immersion gold PCB circuit board

zitrok Electronics Co Ltd

[Province: Guangdong ]

Contact Method

LB-73 material 3.2mm thickness Immersion gold PCB circuit board

Share |

LB-73 material 3.2mm thickness Immersion gold PCB circuit board

HiSupplier Escrow

Add to My Favorites

Trade on HiSupplier, Worry Free Guarantee

•Trading safety, secure your money, lower the risk, protect both buyers and suppliers

•HiSupplier is a Chinese multinational company in U.S, it helps to coordination and order landing.

More ›

Product Details
Company Profile
Product Reviews

Layer count: Rigid PCB 2 - 24 + Layers; Rigid-flex PCB 1 - 10Layers Panel Size(max): 21" x 24" for Rigid, 9.05'' x 47.2'' for FPC Materials: FR-4, roger, high-TG FR-4, halogen-free FR-4 Board thickness: 0.016" to 0.120" Copper weight: Heavy copper PCB (6oz finished) Finishing: hot air leveling/HASL(lead free),Immersion gold, immersion silver, gold fingers, carbon ink, OSP, peelable mask Minimum finishing hole size:0.006" Thru Hole (Finished Size) and 0.004" Buried Via, Hole Size Tolerance: ±0.05mm(PTH); ±0.05mm (NPTH) Aspect ratio: 10:01 Outline Dimension Tolerance: ±0.13mm Conductor Width Tolerance: ±0.05mm or ±20%of Original Artwork Warp & Twist Ratio: 0.70% Insulation Resistance For E/T test: 10K Ω-20M Ω Conductivity Resistance For E/T test: <50 Ω Voltage For E/T test: 300v maximum Registration Tolerance Front/Back Image: 0.075mm Layer to Layer Registration: 0.075mm Board Thickness Tolerance: ±8%(t≥1.0mm); ±0.1(t<1.0mm); Plugging hole Diameter with solder mask: 0.20mm-0.60mm Minimum Solder dam Width: 0.1mm Minimum Solder Mask Clearance: 0.05mm Solder Mask Type/Silkscreen Ink: LPI(green, white, black ,red ,etc) Outline profile: punching, routing, punch and push back Au thickness: 0.0762um-0.762um(Hard Au); 0.0254um-0.127um(Soft Au); Ni thickness: 2.032-7.362um http://www.zitrok-pcb.com

Layer count: Rigid PCB 2 - 24 + Layers; Rigid-flex PCB 1 - 10Layers
Panel Size(max): 21" x 24" for Rigid, 9.05'' x 47.2'' for FPC
Materials: FR-4, roger, high-TG FR-4, halogen-free FR-4
Board thickness: 0.016" to 0.120"
Copper weight: Heavy copper PCB (6oz finished)
Finishing: hot air leveling/HASL(lead free),Immersion gold, immersion silver,
gold fingers, carbon ink, OSP, peelable mask
Minimum finishing hole size:0.006" Thru Hole (Finished Size) and 0.004" Buried Via,
Hole Size Tolerance: ±0.05mm(PTH); ±0.05mm (NPTH)
Aspect ratio: 10:01
Outline Dimension Tolerance: ±0.13mm
Conductor Width Tolerance: ±0.05mm or ±20%of Original Artwork
Warp & Twist Ratio: 0.70%
Insulation Resistance For E/T test: 10K Ω-20M Ω
Conductivity Resistance For E/T test: <50 Ω
Voltage For E/T test: 300v maximum
Registration Tolerance Front/Back Image: 0.075mm
Layer to Layer Registration: 0.075mm
Board Thickness Tolerance: ±8%(t≥1.0mm); ±0.1(t<1.0mm);
Plugging hole Diameter with solder mask: 0.20mm-0.60mm
Minimum Solder dam Width: 0.1mm
Minimum Solder Mask Clearance: 0.05mm
Solder Mask Type/Silkscreen Ink: LPI(green, white, black ,red ,etc)
Outline profile: punching, routing, punch and push back
Au thickness: 0.0762um-0.762um(Hard Au); 0.0254um-0.127um(Soft Au);
Ni thickness: 2.032-7.362um
http://www.zitrok-pcb.com

Send message to this supplier