RO4350B High Frequency PCB 0.8mm Thick with Immersion Gold Applied In Balanced Amplifier
PCB parameter
| PCB SIZE | 193 x 192mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Double sided PCB, 2 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 17.8um(0.5oz)+plate TOP layer |
| RO4350B 30mil (0.762mm) | |
| copper ------- 17.8um(1oz)+plate BOT Layer | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 11.97mil |
| Minmum / Maximum Holes: | 0.3/2.8mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 195 |
| Number of Milled Slots: | 5 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | No |
| BOARD MATERIAL | |
| Glass Epoxy: | RO4350B 30mil (0.762mm), Tg 288 |
| Final foil external: | 1oz |
| Final foil internal: | 0oz |
| Final height of PCB: | 0.8mm ±0.1 |
| PLATING AND COATING | |
| Surface Finish | Immersion Gold (16.2%) 2 micoinch over 100 microinch nickle |
| Solder Mask Apply To: | Top and Bottom, 12micron Minimum |
| Solder Mask Color: | Green, NAN YA, LP-4G/G-05 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial Marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, S-380W, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Balanced amplifier |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) RO4350B High frequency material. Excellent high frequency performance, low dielectric tolerance and loss
b) Immersion gold surface finish, Good oxidation resistance and good heat dissipation.
c) No MOQ, low cost for small quantity prototypes and samples.
d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
More Applications in Electronics
Usb Adapter
Modems
Led Lighting
Power Amplifier
Wireless Adapter
Security Electronics
Digital Repeater
Power Supply System
Power Supply Circuits
48 Vdc Power Supply
PCB knowledge:The Difficulty Factors for Multilayer boards
Multilayer PCB’s represent one of the most complicates products in PCB industry. In order to design producible multilayer PCB’s, it is imperative that PCB designers understand the processes and difficulty factors
*Build-up
The more layers in a multilayer PCB’s, the greater risk of mis-registration during laminate process. The difficulty factor, therefore, increase with an increasing layer counts.
*Core thickness of rigid inner laminates
Inner layers are normally based on thin rigid laminate cores with copper cladding. The thinner the rigid laminates, the more difficult they are to handle, for example, in the etching process.
*Thickness tolerance (total thickness inclusive of copper foils)
The difficulty factor and the rejection rate depend very much upon the thickness tolerance required, and indirectly upon the layer build-up. When thickness tolerance T=±10%, obviously rejection ratio trends to zero.
FAQ
Do you sell via in pad PCB?
Yes. Via in pad (VIP) is a good real estate saving. We offer this kind of PCB for many applications like microcontroller, GPRS etc.
