WL 0.1mm BGA reballing Solder template stencil for iphone Baseband NAND A10 A9 A8 CPU, Ball Soldering Net Stainless Steel for iphone 5/5s 6/6p 6s/6sp 7/7p Baseband and NAND Chip, A6 A7 A8 A9 A10 CPU
WL 0.1mm BGA Reballing Stencil for iphone Baseband NAND A10 A9 A8 CPU
[ Optional BGA Reballing Stencil Package ]:
Optional 1: iphone 5/5s Baseband and NAND
Optional 2: iphone 6/6p Baseband and NAND
Optional 3: iphone 6s/6sp Baseband and NAND
Optional 4: iphone 7/7p Baseband and NAND
Optional 5: A6 CPU upper
Optional 6: A7 CPU upper
Optional 7: A6/A7 CPU Lower
Optional 8: A8 CPU upper
Optional 9: A8 CPU lower
Optional 10: A9 CPU upper
Optional 11: A9 CPU lower
Optional 12: A10 CPU lower
[ Optional Aluminum Mould Base ]: it is universal, can fit with any Black Positioning Mold,
1: Included base
2: Without base
Optional Positioning Mold (Black): Not
univeral, can't working with different BGA Reballing Stencil, need the
right model BGA Reballing Stencil, the Black Positioning Mold just match
with the right BGA Reballing Stencil.
1: Included Positioning Mold
2: Without Positioning Mold
there have 3 parts section, BGA Reballing Stencil + Positioning Mold (Black) + Universal Aluminum Mold Base (Golden)
just the BGA Reballing Stencil 
BGA Reballing Stencil + Black Positioning Mold
Full Set: BGA Reballing Stencil + Positioning Mold (Black) + Universal Aluminum Mold Base (Golden)
0.1-0.12mm thickness, high hardness, hardly deformed, increase the success rate on BGA reballing Solder working, it is the top quality BGA Reballing Stencil for iphone Baseband CPU and NAND, A10 / A9 / A8 CPU..
WL Top quality Fast Speed BGA reballing Solder template stencil
