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[Province: Guangdong ]   
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BGA reballing tools solder wick desoldering wire for chips cleaning
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BGA reballing tools solder wick desoldering wire for chips cleaning

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Basic Info.
  • Place of Origin: Guangdong  
  • Means of Transport: Ocean, Air, Land
Supply Capacity

100% Japan original goot wick,width 3mm,length 1.5mm,was used for cleaning the removal tin on BGA


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Mr. weijunfeng
Tel: 86-755-27513884
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Shenzhen Shuttle Star Industrial Co.,Ltd
10F Beifangjunyi Building,Xingwei Road Crossing,Fuyong,Baoan District, Shenzhen, Guangdong, China (Mainland)
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