High quality Flex PCB/Rigid PCB/Flex Rigid PCB Manufacturer in Shenzhen and 4 layers double face flex-rigid PCB
Hitech pcb which is a professional PCB and PCBA manufacturer in China We have been manufacturing PCB and offer assembly services with component supplying for client around the world over 20 years.assembly services with component supplying for client around the world over 10 years.
One-stop Service:
1. PCB Copy
2. PCB manufacturing
3. Component sourcing
4. PCB Assembly
5. PCBA 100% test
FPC/flex pcb/rigid flex pcb manufacturer ,Custom FPC
Peculiarity of FPC:
1. Small size, high density integration
2. Save space
3. Simplify layout procedure and simplify wiring.
4. Save human resources cost
5. with good flexibility and folded easily and freely.
Application:
*Optical Pick-up for A/V & Computer ( or CD-RW & DVD-RW)
*Digital( or CCD ) Camera
*LCD Module for Mobile Phone
*Vibration Motor for Mobile Phone
Detailed specification of manufaturing capacity:
| NO | Item | Craft Capacity |
| 1 | Layer | 1-30 Layers |
| 2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
| 3 | Rang of finish baords Thickness | 0.21-7.0mm |
| 4 | Max size of finish board | 900MM*900MM |
| 5 | Minimum Linewidth | 3mil (0.075mm) |
| 6 | Minimum Line space | 3mil (0.075mm) |
| 7 | Min space between pad to pad | 3mil (0.075mm) |
| 8 | Minimum hole diameter | 0.10 mm |
| 9 | Min bonding pad diameter | 10mil |
| 10 | Max proportion of drilling hole and board thickness | 1:12.5 |
| 11 | Minimum linewidth of Idents | 4mil |
| 12 | Min Height of Idents | 25mil |
| 13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
| 14 | Soldermask | Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
| 15 | Minimun thickness of soldermask | 10um |
| 16 | Color of silk-screen | White, Black, Yellow ect. |
| 17 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
| 18 | Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
| 19 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
| 20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
| 21 | Thickness of Copper | 0.5-14oz (18-490um) |
Equipment List
| NO. | Machine Name | QTY | NO. | Machine Name | QTY |
| 1 | PRESS | 2 | 10 | Exposurer | 5 |
| 2 | X-Ray | 1 | 11 | Deveoloper | 3 |
| 3 | Brown-Oxidation | 1 | 12 | Auto V-cut | 1 |
| 4 | Drilling | 13 | 13 | AOI | 2 |
| 5 | Cutter | 1 | 14 | Routing | 7 |
| 6 | PTH | 1 | 15 | ETS | 12 |
| 7 | PAL | 1 | 16 | Fly Probe | 4 |
| 8 | PAT | 1 | 17 | YAMAHA SMT | 3 |
| 9 | Flash Gold | 1 | 18 | FUJI SMT | 4 |
PCB and PCB Assembly Lead time:
| Description | Double side | Four Layers | Six Layers | Above Eight Layers | HDI |
| Sample | 4 | 7 | 9 | 9 | 12 |
| Mass production | 7-9 | 10-12 | 13-15 | 16 | 20 |
| Assembly | 7-9 | 15 | 16 | 18 | 25 |
Quote Requirements for PCB and PCB Assembly project:
- Gerber File and Bom List;
- Quote Quantity;
- Advise your technical requirements for quoting reference;
- Clearly picturers of PCB or PCB Assembly Sample to us for reference;
- Test Mothod for PCB Assembly.
