BGA, micro BGA
Flip chip
Tape automated bonding (TAB)
Bare die wire bond
DIP insertion
Component lead forming
IC pre-programming
ESD safe workstation
No clean or aqueous solder process
In circuit testing
100% visual inspection and test
OEM/ODM/EMS service for all sorts of electronic products
Design service
Outstanding electronic component purchasing resource
Fully experienced QC and QA engineers at different stages of production
Fully experienced technical engineers in charge of product design and test
Well trained customer service personnel to provide professional service
No MOQ limited to fulfill the particular volume from customers
Quoting the price for clients within 3 working days and quick response to our customers
Please send us the prototype and we provide sample board for further reference
Flip chip
Tape automated bonding (TAB)
Bare die wire bond
DIP insertion
Component lead forming
IC pre-programming
ESD safe workstation
No clean or aqueous solder process
In circuit testing
100% visual inspection and test
OEM/ODM/EMS service for all sorts of electronic products
Design service
Outstanding electronic component purchasing resource
Fully experienced QC and QA engineers at different stages of production
Fully experienced technical engineers in charge of product design and test
Well trained customer service personnel to provide professional service
No MOQ limited to fulfill the particular volume from customers
Quoting the price for clients within 3 working days and quick response to our customers
Please send us the prototype and we provide sample board for further reference
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