PCB process capability:
1.Layer: 2-22 layer
2.Product type: Rigid PCB,High Density Inverter PCB,thick copper PCB
3.Materials: FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg
4.Copper Thickness: 140micron(4oz)
5.Min Board Thickness: 0.4mm
6.Max Board Thickness: 5.0mm
7.Min finished Hole Diameter: 0.1mm
8.Outer layer line width / spacing: 0.1mm/0.1mm
9.Inner layer line width / spacing: 0.1mm/0.1mm
10.Min aperture: 0.2mm
11.Min Laser drilling: 0.1mm
12.Min Ring Width: 0.11mm
13.Min BGA-bit hole spacing: 0.4mm
14.Resistance Tolerance: ±10%
15.Minimum Insulation Thickness: 3mil
16.Maximum laser blind hole thickness to diameter ratio: 0.8:1
17.Maximum working board size: 520*622mm
18.Drilling Tolerance (PTH): ±0.075mm
19.Drilling tolerance (NPTH): ±0.05mm
20.Outline Tolerance (CNC): ±0.13mm
21.Surface coating: Lead Free HAL, HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask
1.Layer: 2-22 layer
2.Product type: Rigid PCB,High Density Inverter PCB,thick copper PCB
3.Materials: FR-4, CEM-3, Teflon, Aluminum Substrate, Rogers, Halogen Free, High Tg
4.Copper Thickness: 140micron(4oz)
5.Min Board Thickness: 0.4mm
6.Max Board Thickness: 5.0mm
7.Min finished Hole Diameter: 0.1mm
8.Outer layer line width / spacing: 0.1mm/0.1mm
9.Inner layer line width / spacing: 0.1mm/0.1mm
10.Min aperture: 0.2mm
11.Min Laser drilling: 0.1mm
12.Min Ring Width: 0.11mm
13.Min BGA-bit hole spacing: 0.4mm
14.Resistance Tolerance: ±10%
15.Minimum Insulation Thickness: 3mil
16.Maximum laser blind hole thickness to diameter ratio: 0.8:1
17.Maximum working board size: 520*622mm
18.Drilling Tolerance (PTH): ±0.075mm
19.Drilling tolerance (NPTH): ±0.05mm
20.Outline Tolerance (CNC): ±0.13mm
21.Surface coating: Lead Free HAL, HAL, Flash Gold, Immersion Gold, Immersion Tin, Immersion Silver, OSP, Gold Finger Plating, Carbon Ink Printing, Peelable Blue Mask
