CEM3 Copper clad laminate is made of epoxy resin, glass cloth and copper foil. It is of heat resistant, good
mechanical & electrical properties, high peel strength and chemical resistant, Suitable for making flame
resistant PCB of high-grade electronic equipment and auto-instrument line.
mechanical & electrical properties, high peel strength and chemical resistant, Suitable for making flame
resistant PCB of high-grade electronic equipment and auto-instrument line.
Peel strength (35μm copper foil) : min 1.31 N/mm
immerse resistance260℃,20S:no change
Dielectric Voltage:≥40KV
Dielectric Constant (1MHz):≤5.4
| General properties | ||||
| Testitem | Unit | Condition | Spec. | Typicalvalue |
| CEM-3CCL | ||||
| Tg | ℃ | DSC | ~ | 130 |
| Peelstrength | N/mm | 288℃,10s(cu17μm) | 1.05 | 1.5 |
| Flammability | ~ | UL94 | V0 | V0 |
| Volumeresistivity | MΩ.cm | C-96/35/90 | ≥106 | 2.0×108 |
| Surfaceresistivity | MΩ | C-96/35/90 | ≥104 | 2.0×106 |
| ArcResistance | S | D-48/50+D-0.5/23 | ≥60 | 135 |
| Dielectricbreakdown | kv | D-48/50+D-0.5/23 | ≥40 | 60 |
| Dielectricconstant(1MZ) | ~ | C-40/23/50 | ≤5.4 | 4.6 |
| DissipationFactor(1MZ) | ~ | C-40/23/50 | ≤0.035 | 0.017 |
| Thermalstress(Unetched) | ~ | 288℃,10s | Nodelamination Non-foaming | |
| Thermalstress(Etched) | ||||
| FlexuralstrengthLW | N/mm2 | A | ≥276 | 380 |
| FlexuralstrengthCW | ≥186 | 290 | ||
| WaterAbsorption | % | E-1/105+D-24/23 | ≤0.5 | 0.11 |
| ComparativeTrackingIndex | V | IEC60112 | 175~250) | |
| Remark:C=humiditycondition | ||||
| D=immersionconditiondistilledwater | ||||
| E=temperaturecondition | ||||
