Some common alloys include:
90W/10Cu 80W/20Cu 75W/25Cu
Copper tungsten is used for primarily three reasons:
1. Matching coefficient of thermal expansion to a mating material.
2. Thermal conductivity for heat sinks.
3. Density for RF shielding.
1. Matching coefficient of thermal expansion to a mating material.
2. Thermal conductivity for heat sinks.
3. Density for RF shielding.
There are two formulation processes for Cu-W
1. Powdered Metal:
A blending of tungsten, copper and various binders are formed under high pressure and then sintered at high temperatures where the material becomes fully dense.
A blending of tungsten, copper and various binders are formed under high pressure and then sintered at high temperatures where the material becomes fully dense.
2. Infiltration:
The process of infiltrating copper into a tungsten skeleton. This process is performed under pressure and high temperature.
The process of infiltrating copper into a tungsten skeleton. This process is performed under pressure and high temperature.
Each of these processes has its own benefits. Each project is analyzed by our engineering staff to discover the most appropriate & cost effective type of copper tungsten material and forming method to be used. We also provide coating for Cu-W components. Common coating include nickel and gold. Other available coatings include tin, silver, copper, platinum, rhodium and so on.
