Base Material:FR-4
Copper Thickness:1 OZ for each layer
Board Thickness:1.6mm
Min.Hole Size:0.2mm
Min.Line Width:0.2mm
Min.Line Spacing:0.2mm
Surface Finishing:Immersion Gold
Solder mask:Green
Routing:CNC
Packaging:in Vacuum Plastic
Specification:
L2-L7 buried via,drill hole size: 0.2mm
L1-L2/L7-L8 blind via,laser drilling hole size:0.15mm
BGA hole size: 9mil, plugged vias
One-Stop Service:PCB-Components Purchasing-SMT-PCBA-Delivery.
All the PCBs are produced and inspected under IPC Standards.