The SSP series of spherical fused silica powder have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the EMC, electronic packaging, Electronic adhesive, Copper Clad Laminate, Underfiller , daily chemical products and so on.
2.Main Specifications
SiO2 Purity: 99.95% min.
Size: D50, 1-10um per the user's demands.
3.Type and Typical Data
ITEM | UNIT | SSP - 10 | SSP- 7 | SSP- 4 | SSP – 2.5 | SSP- 1 |
Size:D50 | µm | 10±2 | 7.0±1 | 4.0±1 | 2.5±0.5 | 1.0±0.5 |
Size:Dmax | 45 | 30 | 15 | 10 | 5 | |
SiO2content | % | 99.95 | 99.95 | 99.95 | 99.95 | 99.95 |
H2Ocontent | 0.05 | 0.05 | 0.05 | 0.05 | 0.05 | |
percent of spheroidization | >98 | >98 | >98 | >98 | >98 | |
Specific surface area | M2g-1 | 1.0 | 1.5 | 1.7 | 1.9 | 9.0 |
Na | ppm | <10 | <10 | <10 | <10 | <10 |
K | <2 | <2 | <2 | <2 | <2 | |
Ca | <3 | <3 | <3 | <3 | <3 | |
Mg | <1 | <1 | <1 | <1 | <1 | |
Al | <50 | <50 | <50 | <50 | <50 | |
Fe | <10 | <10 | <10 | <10 | <10 | |
Ti | <10 | <10 | <10 | <10 | <10 | |
As | <1 | <1 | <1 | <1 | <1 | |
P | <1 | <1 | <1 | <1 | <1 | |
Cr | <1 | <1 | <1 | <1 | <1 | |
Mn | <1 | <1 | <1 | <1 | <1 | |
Ni | <1 | <1 | <1 | <1 | <1 | |
Cu | <1 | <1 | <1 | <1 | <1 | |
Mo | <1 | <1 | <1 | <1 | <1 | |
U | ppb | <0.3 | <0.3 | <0.3 | <0.3 | <0.3 |
pengl $ sinosi , org
