Home > Electronic & Electrical > Electronics Production Machinery > Professional Fr-4 Printed Circuit Board Fabrication, Immersion Tin Single Layer Pcb / BGA Assembly S

Fortune Mount International Ltd

[Province: Guangdong ]

Contact Method

Professional Fr-4 Printed Circuit Board Fabrication, Immersion Tin Single Layer Pcb / BGA Assembly S

Share |

Professional Fr-4 Printed Circuit Board Fabrication, Immersion Tin Single Layer Pcb / BGA Assembly S

HiSupplier Escrow

Add to My Favorites

Trade on HiSupplier, Worry Free Guarantee

•Trading safety, secure your money, lower the risk, protect both buyers and suppliers

•HiSupplier is a Chinese multinational company in U.S, it helps to coordination and order landing.

More ›

Product Details
Company Profile
Product Reviews

Professional Fr-4 Printed Circuit Board Fabrication, Immersion Tin Single Layer Pcb / BGA Assembly Service

Our services for the PCB Assembly

Re-layout for shortening the board size
Bare pc board fabrication
SMT/BGA/DIP assembly
Full component procurement or the substitute components sourcing
Wire harness and cable assembly
Metal parts, rubber parts and plastic parts including mold making
Mechanical, case and rubber molding assembly
Functional testing
Repairs and inspection of the sub-finished / finished goods

Our capabilities for the PCB Assembly

Stencil Size Range	736 mm x 736 mm
Min. IC Pitch	0.30 mm
Max. PCB Size	410 mm x 360 mm
Min. PCB Thickness	0.35 mm
Min. Chip Size	0201 (0.6 mm X 0.3 mm)
Max. BGA Size	74 mm X 74 mm
BGA Ball Pitch	1.00 mm (Min) / F3.00 mm (Max)
BGA Ball Diameter	0.40 mm (Min) /F1.00 mm (Max)
QFP Lead Pitch	0.38 mm (Min) /F2.54 mm (Max)
Frequency of Stencil Cleaning	1 time / 5 ~ 10 Pieces

Our capabilities for handling the Bare PC Board fabrication

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
Impedance Control V-scoring ±10%
Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
Immersion Silver, OSP, Hard Gold( up to 100u”)

UL and TS16949: 2002 marks
Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
Profiling: punching, routing, V-cut and beveling
OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided

Our manufacturing experience includes, but is not limited to:

Note Book fields

CHARGER BOARD

INVERTER

POWER CPU

Send message to this supplier