TSSOP, QFP, BGA Printed Circuit Board Assembly, Oem Turnkey Electronics Manufacturing Service
Our services for the PCB Assembly
- Re-layout for shortening the board size
- Bare pc board fabrication
- SMT/BGA/DIP assembly
- Full component procurement or the substitute components sourcing
- Wire harness and cable assembly
- Metal parts, rubber parts and plastic parts including mold making
- Mechanical, case and rubber molding assembly
- Functional testing
- Repairs and inspection of the sub-finished / finished goods
Key Specifications/Special Features:
- Our manufacturing facilities include clean workshops and high speed advanced SMT lines
- Our placement precision can reach chip +0.1mm on integrated circuit parts, which means we can almost deal with all kinds of integrated circuits such as SO, SOP, SOJ, TSOP, TSSOP, QFP, BGA and U-BGA
- Additionally, we can provide 0201 chip placement, through-hole components insertion and finished products fabrication, testing and package
- Production of customer designed components
- SMD assembly and through-hole components insertion
- IC preprogramming
- Function verification and burn in testing
- Complete unit assembly (which including plastics, metal box, coil, cable inside and more)
- Environmental coating
- Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure
- Packaging design
- We are committed to improving our product quality constantly
- The products delivered from us shall be full quality checked, striving to 100% customer's satisfaction is our long term mission
- To work with a reliable EMS provider with high mixed, low volume order, contact us today
Our capabilities for the PCB Assembly
|
Stencil Size Range |
736 mm x 736 mm |
|
Min. IC Pitch |
0.30 mm |
|
Max. PCB Size |
410 mm x 360 mm |
|
Min. PCB Thickness |
0.35 mm |
|
Min. Chip Size |
0201 (0.6 mm X 0.3 mm) |
|
Max. BGA Size |
74 mm X 74 mm |
|
BGA Ball Pitch |
1.00 mm (Min) / F3.00 mm (Max) |
|
BGA Ball Diameter |
0.40 mm (Min) /F1.00 mm (Max) |
|
QFP Lead Pitch |
0.38 mm (Min) /F2.54 mm (Max) |
|
Frequency of Stencil Cleaning |
1 time / 5 ~ 10 Pieces |
Our capabilities for handling the Bare PC Board fabrication
Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD
Layers 2-30 L
Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
Isola, Taconic, Arlon, Teflon, Aluminum Based
Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
Outline Tolerance ±4mil ±0.10mm
Board Thickness 8mil-236mil / 0.2mm-6.0mm
Board Thickness Tolerance ±10%
Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
Min. Track Width 3mil / 0.075mm
Min. Track Space 3mil / 0.075mm
External Cu Thickness HOZ-6OZ / 17um~210um
Internal Cu Thickness HOZ-6OZ / 17um~210um
Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
Hole Tolerance ±2mil / ±0.05mm
Hole Position Tolerance ±2mil / ±0.05mm
Laser Drilling Hole Size 4mil / 0.1mm
Aspect Ration 12:1
Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
Min Solder mask Bridge 2mil / 0.050mm
Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
Impedanc
