Product Technical Information
Menu | single-sided board | double-sided board | Mullet-layer board |
Layers | 1 | 2 | 4-12 |
copper-clad Thickness | 0.5~10oz | 0.5~10oz | 0.5~10oz |
Chips Thickness | 0.2~3.0mm | 0.2~3.0mm | 0.40~5.2mm |
block burn characteristic | 94V-0 | 94V-0 | 94V-0 |
resist peel difficult intensity | 10.4N/cm | 12.3N/cm | 12.3N/cm |
warp linear measure | ≤ 1.5% | ≤ 0.5% | ≤ 0.5% |
insulation resistance | ≥ 10 | ≥ 10 | ≥ 10 |
test voltage | 50-100DCV | 100DCV | 100-200DCV |
finished product board acreage | 400×500mm | 560×610mm | 560×610mm |
minimum Line width and wire apart | 0.20/0.20mm | 0.10/0.10mm | 0.10/0.10mm |
Empty wall copper thickness | ≥ 25.0um(single point) | ≥ 25.0um(single point) | |
minimum weld endothecium | 0.05mm | ||
annular outer layer | 0.10mm | 0.076mm | 0.076mm |
least aperture path | 0.30mm | 0.20mm | 0.20mm |
hole tolerance | ±0.076mm | ±0.076mm | |
hole place tolerance | ±0.076mm | ±0.076mm | ±0.05mm |
figure tolerance | ±0.15mm | ±0.10mm | ±0.10mm |
Green oil bridge capability | ≥ 0.20mm | ≥ 0.10mm | ≥ 0.075mm |
block weld rigidity | 6H | 6H | 6H |
exterior plating layer | OSP,HAL.Soft gold | OSP,HAL immersion gold. | OSP,HAL.immersion |
Our Services.
We provide following service to all of our customers:
1. PCB production service. Available on FR-4,TG150-180,Aluminum, FPC
2. PCB copy service
3. PCB assembly service. Available on SMT, BGA, DIP.
4. And Box build assemble. Available on Final Functional testing and final package
5. Electronic Component purchasing service
1. PCB production service. Available on FR-4,TG150-180,Aluminum, FPC
2. PCB copy service
3. PCB assembly service. Available on SMT, BGA, DIP.
4. And Box build assemble. Available on Final Functional testing and final package
5. Electronic Component purchasing service
If You have any interest in our Product.
Please contact us at any time.
We are very glad to service for You! :)
