LESON FR4 Copper Clad Laminate is a kind of copper foil covered laminated board formed through heat pressing after the electric industry alkali-free glass fiber dips into thermoset epoxy resins and is covered with copper foil at one side or both sides. Usually used in PCB with printed circuit on one or both sides of computers, home electric appliances and other lines.
FR4 Copper Clad Laminate | |
1.Material | composite polymer(flame- retardant epoxy resin, E-glass fiber cloth with copper as cladding |
2.Technics | Mixing ,Coating,Folding,Laminated,Return Line,Cutting,Packing |
3.Color | natural color(light green ),yellow, and black,or as per customer's requirement |
4.Measurement | 41"X49",43"X49"(1040*1240mm) |
5. Feature: | Lead Free, Flame retardant, thermal reliability, lower warpage, |
6.Using scope | Suitable for high-count layer PCB, computer, communication equipment, OA equipment, lead-free PCB process, etc. |
7.Packing | carton packaging/ 250 sheet per pallet |
8. Certification | ISO9001,ISO14001,CQC,UL |
9.Payment | T/T,L/C, Western Union ,USD |
10. Technological requirements | For your choices |
Properities
1.Tg≥170°C(DSC)
2.UV blocking and AOI compatible ,so as to increase productivity efficiency
3.High thermal performance ,Td ≥325°C,T288≥5min,suitable for lead-free process.
4.Good flatness, smooth surface,no pits
Application
Suitable for high-count layer PCB, computer, communication equipment, OA equipment,
lead-free PCB process etc
Technician Data
| Item | Test condition | Unit | SPEC | Typical Value | |
Tg | DSC | °C | ≥170 | 175.2 | |
Peel strength(1OZ) | 288°C,10S | N/mm | ≥1.05 | 1.41 | |
Thermal Stress | 288°C,10S/solder dip | ____ | No delamination | 180S/ No delamination | |
Flammability | N/mm2 | LW | ≥415 | 580 | |
CW | ≥345 | 482 | |||
Surface Resistivity | After moisture | MΩ | ≥1. 0×104 | 2,52×107 | |
Volume Resistivity | After moisture | MΩ.cm | ≥1.0×105 | 3.21×108 | |
Dielectric Constant | 1MHz C-24/23/50 | ____ | ≤5.4 | 4.7 | |
Loss Tangent | 1MHz C-24/23/50 | ____ | ≤0.035 | 0.016 | |
Arc Resistivity | D-48/50+D-0.5/23 | S | ≥60 | 122 | |
Dielectric Breakdown | D-48/50+D-0.5/23 | KV | ≥40 | 58 | |
Moisture Absorption | D-24/23 | % | ≤0.5 | 0.1 | |
Td | Weight loss 5% | °C | 340 | 347 | |
CTE Z—axis | Alpha 1 | TMA | ppm/°C | ≤60 | 45 |
Alpha 2 | ppm/°C | ≤300 | 270 | ||
50-260°C | % | ≤3.0 | 2.9 | ||
T288 | TMA | min | ≥15 | 30 | |
CTI | IEC60112 Method | V | 175~250(Grade 3) | 200 | |
Suggestion for use
Please baking the laminate at 150°C,2 hours before using.
Please pay attention to the machining for the interbedded energy is lower than the normal FR-4.Rilling parameters are mainly dependent on hole size ,layer thickness, layer number ,copper thickness and stack height.
The following drilling parameters are for reference only .Typical drilling parameters for 0.4 ~1.0mm drills are as follows:
speed :45 ~105 KRPM
Feed rate:50~150 IPM
Retract rate:;500~1000 IPM
Suggest hit count:1500 HITS
Stack height:≤2pnls(2~6 layers), 1pnls(≤8 layers)
Entry Material:0.2mm Aluminum
