Application:
· Optical Pick-up for A/V & Computer ( or CD-RW & DVD-RW)
· Digital( or CCD ) Camera
· LCD Module for Mobile Phone
· Vibration Motor for Mobile Phone
FPC Process Capability
· processing layers:1-6 layers
· Finished thickness (thinnest): 3mil (0.08mm)
· Minimum aperture: 4mil (0.10mm)
· Minimum line width / spacing: 2 mil (0.05mm)
· Maximum board size: 10 "x 45" (250x 1200mm)
· Surface Treatment: OSP, HASL, Electric Nickel / Gold, , Chemical nickel / gold, lead-free HASL, Immersion Gold
· Insulation resistance: ± 1011Ω (Normal Normal
· Thermal shock resistance: 260 °C 10 sec.
· Processing materials: polyimide (PI), polyester (PET), polyimide (PI) + FR4
PLS contact:sabrina----sales(at)lxpcba(dot)com
PLS contact:sabrina----sales(at)lxpcba(dot)com
