The ultra-flexible KE-2080 can place a wide range of components from 0402 (01005) and ICs, to odd-form,
all at industry leading accuracy and speed.
Chip
20,200CPH(laser centering/Optimum)(0.178Sec./chip)
16,700CPH(laser centering/IPC9850)
IC
1,850CPH (vision centering / effective tact)
4,860CPH with MNVC option.
One multi-nozzle laser head (6 nozzles) plus one high resolution head (1 nozzle)
From 0402 (01005) to 74mm square components or 50×150mm
Vision centering system (featuring bottom, side, and back lighting, all ball recognition and split recognition)
1 Actual throughput may vary.
2 Please download brochure for details.
Board size : M size (330×250mm)
L size (410×360mm)
L-Wide size(510×360mm) (option)
E size (510×460mm)*1
Component size
Laser recognition : 0402 (01005)33.5mm
Vision recognition
Standard camera : 3mm 74mm or 50×150mm
High-resolution camera (option) :1.0×0.5mm*3 48mm or 24×72mm
Placement speed
Chip
Optimum : 0.178Sec./chip(20,200CPH)
IPC9850 : 16,700CPH
IC*4 : 1,850CPH
4,860CPH*5
Placement accuracy
Laser recognition : ±0.05mm(Cpk 1)
Vision recognition:±0.03mm (±0.04mm when using MNVC)
Feeder inputs : Max. 80 on 8mm T/F*6
1 Please ask for details on E size board.
2 When using MNVC. (option)
3 When using high-resolution camera. (option)
4 Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
(CPH=number of components placed for one hour)
5 Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
6 Including matrix tray changer, max 110.
