PCB/ PCBA Technic
1).Professional surface mounting and through hole soldering technology;
2).Various sizes,like 1206,0805,0603 components SMT technology;
3).ICT(In Circuit Test),FCT(Functional Circuit Test) technology;
4).Nitrogen gas reflow soldering technology for SMT;
5).High standard SMT&Solder Assembly line;
6).High density interconnected board placement technology capacity.
PCB/ PCBA Quote requirement
1).The detailed files(Gerber file/ PADS/ AutoCAD/ Protell/ Power PCB/ DWG/ schematic etc and BOM);
2).Clear pictures of PCBA or samples for us;
1.Professional engineer can provide PCB circuit design,BOM and diagram drawings.
2.Provide PCB &PCBA prototype, and medium&low volume quick board services.
3.Compoent purchasing, SMT/PCBA one-stop source, with the professional purchasing team
4.One-hour quote response, 24 hours quick-turn produce
5.Variety terms of delivery,customize the flexibility to choose
Application
- Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect.
- By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries
NO | ITEM | Technical Data |
1 | Layer | 2-20 Layers |
2 | Board material | FR4,FR4 Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base |
3 | Max.Board Size0 | 457*660mm |
4 | Min.Board Thickness | 2 layers 0.2mm |
4 layers 0.4mm | ||
6 layers 0.8mm | ||
8 layers 1.0mm | ||
10 layers 1.2mm | ||
5 | Max.Board Thickness | 8.0mm |
6 | Min.Line Width | 0.05mm |
7 | Min.Line Space | 0.05mm |
8 | Min.Hole Size0 | Electroplating Via 0.15mm |
Micro via 0.075mm | ||
9 | PTH Wall Thickness) | 20-25um |
10 | Max.finish copper thickness0 | 8OZ |
11 | PTH Dia.Tolerance | ±0.05mm |
12 | NPTH Dia.Tolerance | ±0.025mm |
13 | Hole Position Deviation | ±0.05mm |
14 | Outline Tolerance | ±0.1mm |
15 | Min.S/M Pitch | 0.08mm |
16 | Insulation Resistance | 3x10Sec, 288°C |
17 | Warp and Twist | ≤0.7% |
18 | Electric Strength | >1.3KV/mm |
19 | Peel Strength | ≥1.4N/mm |
20 | Solder Mask Abrasion | ≥6H |
21 | Flammability | 94V0 |
22 | Impedance Control | ±5% |
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