We can provide OEM membrane switches, FPC, silicon rubber, EL, touch screens and assemblies
A. Material : Rohs compliant material ,for example ,Autotype ,3M ,Nicomatic.
B. Dimension : According to customer 's drawing or design ,OEM design.
C. Color: Pantone and Ral color match system.
D. constrution : various types to meet customer 's demand.
Advantage:
1.Accurate and strick color matching according to customer's requirement,both Panton and Ral color matching system ,using advanced light box and computer color mataching,we can also do half-tone printing
2. Good material control to make sure all the material are high quality ,all the material we used are Rohns compliant
3.Our engineer will work with customers and reommend specail constrution design to meet customer's desires ,such water proof ,dust proof and anti corrasion and so on
4. Strick quality inspection ,100 % funtional tesiting ,and we can also do specified testing ,such as humility testing ,life expectancy testing ,actuation force testing.
5. We are qualified Dara switch .5. Except membrane switch and touch screen, we can also do different types of assembly,such as membrane switch and touch screen with FPC, PCB ,silicone rubber ,metal backer ,plastic bezel and so on.
6. We can accept small quantity order and offer competitve price.
Technical Parameters
1. Electrical
Maximum Circuit Rating: 35V(DC),100mA,1W
Contact Resistance: 10Ω~ 500Ω (Varies from the trace length and material)
Insulation Resistance: 100MΩ 100V
Dielectric: 250 Vrms (50~60Hz 1min)
Contact Bounce: < 5ms
Life: Flat: ≥ 5million times
Tactile: ≥ 1 million times
Duraswitch: ≥ 10million times
2. Mechanical
Actuation Force: Flat: 57~284g(2~10oz)
Tactile: 170~397g(6~14oz)
Switch Height: Flat: 0.1~0.5mm
Tactile: 0.6~1.5mm
3. Environment
Operation Temperature: -40~+80 Degree Centigrade
Storage Temperature: -40~+80 Degree Centigrade
Humidity: 90%~95%, 240 hours
Vibration: 20G, max (10~200Hz,Mil-SLD-202,M204.Condition B)
FPC Production capacity
FPC Production capacity
| FPC Production Capacity | |||||
| ITEM | TECHNICAL PARAMETER | ||||
| Layers | 1-6 Layers | ||||
| Mini thickness | 0.08mm | ||||
| Min.Line Width | 0.05mm | ||||
| Min.Hole Size | 0.15mm PTH | ||||
| Min. PTH Hole Ring | 0.45mm | ||||
| Min. Gap between Cover Layer and Pad | 0.1mm | ||||
| Min. Gap between Trace and Outline | 0.2mm | ||||
| Trace Width Tolerance | ±0.03mm W±30% | ||||
| Outline Tolerance | ±0.05mm L≤25mm | ||||
| Hole Size Tolerance | ±0.05mm | ||||
| Stiffener and Outline Tolerance | ±0.1mm | ||||
| Surface Treatment | ENIG,Gold Plating,HAL,Plating Pb-Sn | ||||
PCB craft capability
Description | Specification Inch (mm) | ||
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant) /CEM-3/CEM-1/Aluminium | ||
Layer No. | 1-12 | ||
Board thickness | 0.015"(0.4mm)-0.125''(3.2mm) | ||
Board Thickness Tolerance | ±10% | ||
Cooper thickness | 1/2OZ-3OZ | ||
Impedance Control | ±10% | ||
Warpage | 0.075%-1.5% | ||
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) | ||
Images | |||
Min Trace Width (a) | 0.005"(0.125mm) | ||
Min Space Width (b) | 0.005"(0.125mm) | ||
Min Annular Ring | 0.005"(0.125mm) | ||
SMD Pitch (a) | 0.012"(0.3mm) | ||
BGA Pitch (b) | 0.027"(0.675mm) | ||
Regesiter torlerance | 0.05mm | ||
Solder Mask | |||
Min Solder Mask Dam (a) | 0.005"(0.125mm) | ||
Soldermask Clearance (b) | 0.005"(0.125mm) | ||
Min SMT Pad spacing (c) | 0.004"(0.1mm | ||
Solder Mask Thickness | 0.0007"(0.018mm) | ||
Holes | |||
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) | ||
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) | ||
Aspect Ratio | 6:1 | ||
Hole Registration | 0.004"(0.1mm) | ||
Plating | |||
HASL | 2.5um | ||
Lead free HASL | 2.5um | ||
Immersion Gold | Nickel 3-7um Au:1-3u'' | ||
OSP | 0.2-0.5um | ||
Outline | |||
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) | ||
Beveling | 30°45° | ||
V-cut | 15° 30° 45° 60° | ||
Certificate | ROHS ISO9001:2000 TS16949 SGS UL certificate | ||
2.PCBA assemble capability
Quantity | Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
Type of Assembly | SMT,Thru-hole |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
File Formate | Bill of Materials Gerber files Pick-N-Place file |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |
SMT FPC IN CONNECTOR
