Aluminum base copper clad laminate pcb board

Price: 0.1~0.5 USD
Trade Term: FOB
Payment Terms: T/T,WU,
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Basic Info.
  • Number of Layers: 4-Layer 
  • Brand Name: tws 
  • Base Material: fr4 
  • Copper Thickness: 1oz 
  • Board Thickness: 1.6mm 
  • Min. Hole Size: 0.15mm 
  • Min. Line Width: 0.2mm 
  • Min. Line Spacing: 0.2mm 
  • Surface finishing: HASL&ENIG 
  • Solder mask: Green/Blue/Black/White/Yellow/Red etc 
  • Max size of finish board: 9200*900mm 
  • Certification: UL/SGS/ROHS 
  • Controlled impedance: ±5% 
  • Warp&Twist: 0.7% 
  • Rang of finish boards thickness: 0.21~7.0mm 
  • Layer count: 1~28 
  • OEM/ODM: One-stop service 
  • PCB standard: IPC-A-610D 
  • Place of Origin: Guangdong  
  • Min.Order: 5 Piece/Pieces
  • Means of Transport: Ocean, Air, Land
Supply Capacity
  • Production Capacity: 300000 Square Meter/Square Meters / Month
  • Packing:vacuum package+carton box
  • Delivery Date: 10-15 working days for mass pcb order.
aluminum base copper clad laminate

Our Advantages:
  • aluminum base copper clad laminate
  • 10 years factory experience
  • Provide PCB &PCBA prototype, and medium&low volume quick board services.
  • One-hour quote response, 24 hours quick-turn produce
  • Components purchasing, SMT/PCBA one-stop source
  • ISO 9001,UL RoHs, SGS certificate
One-stop Service:
  • PCB / FPC/ PCBA Copy
  • PCB drawing / design according to schematic diagram
  • PCB manufacturing
  • Component sourcing
  • PCB Assembly
  • PCBA test
Products using range:
Our products are widely used in communication apparatus, automobile electronics, computers, medical devices and network devices and consumer electronics class fields.
Aluminum base copper clad laminate pcb board



Maximum Process PCB board Capability:
Item
Manufacture Capability
Material
FR-4 / Hi Tg FR-4 / Taconic / Rogers / F4BK /CEM-3 / Aluminium / other Metal based
Layer No.
1-20
Finished Board thickness
0.2 mm-3.8mm'(8 mil-150 mil)
Board Thickness Tolerance
±10%
Cooper thickness
0.5 OZ-11OZ (18 um-385 um)
Copper Plating Hole
18-40 um
Impedance Control
±10%
Warp&Twist
0.70%
Peelable
0.012"(0.3mm)-0.02'(0.5mm)
Images
Min Trace Width (a)
0.1mm (4 mil)
Min Space Width (b)
0.1mm (4 mil)
Min Annular Ring
0.1mm (4 mil)
SMD Pitch (a)
0.2 mm(8 mil)
BGA Pitch (b)
0.2 mm (8 mil)
Solder Mask
Min Solder Mask Dam (a)
0.0635 mm (2.5mil)
Soldermask Clearance (b)
0.1mm (4 mil)
Min SMT Pad spacing (c)
0.1mm (4 mil)
Solder Mask Thickness
0.0007"(0.018mm)
Holes
Min Hole size (CNC)
0.2 mm (8 mil)
Min Punch Hole Size
0.9 mm (35 mil)
Hole Size Tol (+/-)
PTH:±0.075mm;NPTH: ±0.05mm
Hole Position Tol
±0.075mm
Plating
HASL
2.5um
Lead free HASL
2.5um
Immersion Gold
Nickel 3-7um Au:1-5u''
OSP
0.2-0.5um
Outline
Panel Outline Tol (+/-)
CNC: ±0.125mm, Punching: ±0.15mm
Beveling
30°45°
Gold Finger angle
15° 30° 45° 60°
Certificate
ROHS, ISO9001:2008, SGS, UL certificate


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ALUMINUM BASE COPPER CLAD LAMINATE

Send message to this supplier
Ms. Grace
Tel: 86-755-29087997
Mobile: 13510820959
Enter between 20 to 3,000 chatacters.
Contact Method
Shenzhen Tianweisheng Electronic Co., Ltd.
4F, No. 48 Bldg., Gongle Ind. Zone, Xixiang Street, Bao' an District, Shenzhen, Guangdong, China (Mainland)
Fax: 86-755-29667579
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