Optoelectronic glass-to-metal seal product

Trade Term: FOB
Payment Terms: T/T
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Basic Info.
  • consists of two components: a header and a cap 
  • production: conventional, standard designs and sizes 
  • Product Advantages1: Effective hermetic sealing 
  • Advantages2: Long-term efficacy 
  • Advantages3: High reliability 
  • Place of Origin: Shaanxi  
  • Min.Order: 1000 Piece/Pieces
  • Means of Transport: Ocean
Supply Capacity
  • Production Capacity: 100,000 per day
  • Packing:according to requirement
  • Delivery Date: 15-30 days
 product name :Optoelectronic glass-to-metal seal product

The core objective of our Opto-Electronics Product Division is to offer long-lasting protection for opto-electronic components, which at the same time allows for the safe transmission of optical signals.
Product Description
A TO package always consists of two components: a header and a cap. The TO header provides a mechanical basis for the installation of electronic and optical components such as semiconductors, laser diodes or simple electronic circuits, while at the same time providing power to the encapsulated components with the aid of pins.
Product Advantages
We are experienced in the production of TO headers in all conventional, standard designs and sizes,such as TO-45,TO-56,TO-5,TO-3,TO-8,TO66,TO-38,TO-39 and so on.
Technology Specifications
The types of metal used in the manufacture of TO headers depend largely on the production methods used. Compression glass seals are generally manufactured using cold rolled steel (i.e. AISI 1010), while matched seals are primarily manufactured using Kovar (ASTM-F15) and Alloy 52 (ASTM-F30).
The TO headers can be plated with various materials (nickel, nickel-gold, nickel-silver), and can also be coated in additional metal layers when required.
Optoelectronic glass-to-metal seal product
Product Description
The term "hybrid package" or "microelectronic package" refers to the hermetically sealed packaging of encapsulated and non-encapsulated components in one container. It is generally used if it is not possible to protect the component to be en capsulated using standard packaging, due to a special number or arrangement of feedthroughs.
Product Advantages
1) Effective hermetic sealing
2) Long-term efficacy
3) High reliability
Technology Specifications
All microelectronic packages are produced according to customer specifications, since there are no general standards governing their manufacture. The types of glass and metal used, as well as the types of electroplating, can be adapted to customer requirements.
  • Datacommunication
  • Microwavepackaging
  • Industriallasers
  • Medicaltechnology
  • Sensortechnology
  • Powerelectronics

Send message to this supplier
Ms. Maggie (Manager)
Tel: 86-29-86968453
Mobile: +86-15002961627
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Contact Method
Xi'an Taijin Industrial Electrochemical Technology Co., LTD.
No.15 XiJin Road,JingWei industrial Park,Economic & Technological Development Zone, Xi'an, Shaanxi, China (Mainland) / 710201
Fax: 86-29-86968453
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