Features:
1. Infrared welding technology .
2. Infrared heating, can avoid the IC damage due to the fast or uninterrupted heating up.
3. Easy operate; user can operate skillfully after one-day training.
4. No need welding tools, it can weld any chips under 50mm.
5. With 800W hot melt system, preheating range 240*180mm.
6. It doesn't impact the smart parts without hot air, and suits to weld BGA, SMD, CSP, LGA, QFP, PLCC and BGA reballing.
7. It suits for a variety of computer, notebook, play station's BGA components, especially in a Northbridge/ Southbridge chipset of computer.
Warranty
Warranty – the main body maintains for one year and the spare parts maintains for three months.
Service – provide the immediate network online Q/A and the technical advisory work service
Delivery
Safe packing and fast delivery by air express.
