It is generally used if it is not possible to protect the component to be en capsulated using standard packaging, due to a special number or arrangement of feedthroughs.
Product Advantages
1) Effective hermetic sealing
2) Long-term efficacy
3) High reliability
Technology Specifications
All microelectronic packages are produced according to customer specifications, since there are no general standards governing their manufacture. The types of glass and metal used, as well as the types of electroplating, can be adapted to customer requirements.
Applications
· Data communication
· Microwave packaging
· Industrial lasers
· Medical technology
· Sensor technology
· Power electronics
