Specifications
1. Minimum Order : No MOQ
2. 2~ 42 Layer rigid multilayer PCB
Number of layers: 2~ 16 Layer rigid multilayer PCB
Surface finish: HASL; Lead-free HASL; OSP; immersion silver; immersioin gold
carbon ink; selective gold
1 | Layer | 1-12 layer |
2 | Material | FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,Aluminum material |
3 | Board thickness | 0.2mm-7mm |
4 | Max panel size | 630mm*520mm |
5 | Min.drilled hole size | 0.25mm |
6 | min.line width | 0.075mm(3mil) |
7 | min.line spaceing | 0.075mm(3mil) |
8 | Surface finish/treatment | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
9 | Copper thickness | 0.5-4.0oz |
10 | Solder mask color | green/black/white/red/blue/yellow |
11 | Inner packing | Vacuum packing,Plastic bag |
12 | Outer packing | standard carton paking |
13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
14 | Certificate | UL,ISO9001,ISO14001,ISO/TS16949,ROHS |
15 | profiling punching | Routing,V-CUT,Beveling |
PCB Production Capability
Manufacture | UL Compliance | √ |
IPC Class2 | √ | |
Products& | Available laminate | FR-4 Tg135/Tg150/Tg170 |
PCB Maximum Layer | 30 | |
Board Thickness | 0.2mm to 8.0mm | |
Min. Track Width/Space | 3mils/3mils | |
Min. Annular Ring | 3mils | |
Min. finished hole size | 4mils/0.1mm | |
Copper thickness | 0.5oz to 10oz | |
Impedance control | +/-10% | |
Surface Finishing | Leaded Solder HASL | √ |
Lead-Free Solder LF HASL | √ | |
Immersion Gold/ENIG | √ | |
Immersion Silver | √ | |
Immersion Tin | √ | |
OSP | √ | |
Carbon Priting | √ | |
Gold finger | √ | |
Outline Profiling | CNC Routing | √ |
V-Groove | √ | |
Punching | √ | |
Edge Plating | √ | |
File Format | GERBER | √ |
PROTEL 99SE | √ | |
PROTEL DXP | √ | |
POWER PCB | √ | |
CAM350 | √ | |
GCCAM | √ | |
ODB+(.TGZ) | √ |
1 | Layer | 1-12 layer |
2 | Material | FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,Aluminum material |
3 | Board thickness | 0.2mm-7mm |
4 | Max panel size | 630mm*520mm |
5 | Min.drilled hole size | 0.25mm |
6 | min.line width | 0.075mm(3mil) |
7 | min.line spaceing | 0.075mm(3mil) |
8 | Surface finish/treatment | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
9 | Copper thickness | 0.5-4.0oz |
10 | Solder mask color | green/black/white/red/blue/yellow |
11 | Inner packing | Vacuum packing,Plastic bag |
12 | Outer packing | standard carton paking |
13 | Hole tolerance | PTH:±0.076,NTPH:±0.05 |
14 | Certificate | UL,ISO9001,ISO14001,ISO/TS16949,ROHS |
15 | profiling punching | Routing,V-CUT,Beveling |
16. providing you one-stop pcb assemblies service. | ||
