It is generally used if it is not possible to protect the component to be en capsulated using standard packaging, due to a special number or arrangement of feedthroughs.
Product Advantages
1) Effective hermetic sealing
2) Long-term efficacy
3) High reliability
3.Technology Specifications
All microelectronic packages are produced according to customer specifications, since there are no general standards governing their manufacture. The types of glass and metal used, as well as the types of electroplating, can be adapted to customer requirements.
Applications
· Data communication
· Microwave packaging
· Industrial lasers
· Medical technology
· Sensor technology
· Power electronics
4.test equipment
5..quality certificate
Our total vertical integration includes:
1. Machining:
l Bodies, shells or metal housings: Inconel, Kovar and Nickel Alloys, Stainless Steel, Cold-Rolled Steel, Titanium
l Electrodes and contacts: Alloy 52, Inconel, Kovar, Molybdenum, Stainless Steel
2. Stamping
3. Precision grinding and lapping
4. Glass sintering furnaces
5. 5 Furnaces for glass-to-metal sealing
6. Innovative electroplating technology, including:
l Nickel (3 types)/ Tin, Tin-lead, Hot Solder Dip, Electropolishing of stainless steel
l Complete chemical analysis capability
7. Inspection / Testing
l Statistical Process Control/Optical comparators
l Humidity testing
l Temperature Cycling
l Optical Measuring Machines
l Hermeticity validation to 1 x 10-11 cc/sec of helium at 1 atmosphere differential pressure
l Insulation resistance to 10 gigaohms at 500 VDC
l Salt spray
