Dust Proof Copper Foil Flexible Printed Circuit Board For Mobile Phone

Trade on HiSupplier, Worry Free Guarantee
Trading safety, secure your money, lower the risk, protect both buyers and suppliers
HiSupplier is a Chinese multinational company in U.S, it helps to coordination and order landing.
More ›
  • Product Details
  • Company Profile
  • Product Reviews

 

 

 

  1. Material: PI: 1 mil
  2. Cu: 1 oz
  3. PI: 1 mil
  4. Surface treatment: pure-tin plating
  5. Minimum hole dimension: 0.3mm
  6. Minimum linear width: 0.08mm
  7. Minimum linear distance: 0.08mm
  8. External tolerance:+/-0.05mm
  9. Welding resistance: 280 more than 10 seconds
  10. Peeling Strength: 1.2kg/cm2
  11. Heat resistance: -200 to +300 degrees C
  12. Surface resistivity: 1.0 x 1011
  13. Bandability: meet IPC standard
  14. Chemical resistance: meet IPC standard

 

1. Flexibility
It can be bent, folded and deformed freely. Its coil radius is small and it can be moved freely along X, Y, Z axis separately.

 

2. Occupy small space
Since it is light and thin, it makes best use of the narrow space in the instruments. (average thickness 1.1-0. Am)

 

3. Light weight
Its weight is very light because the design of FPC is not based on mechanical strength but current load.

 

4. Good seal capability
The flexible board could be designed for low- tensile seal enduring the adverse environment.

 

5. Steady transmission
The wiring pattern and the conductor distance can be freely designed according to electric parameters. Once the pattern is finalized, parameters of R. L. C is steady accordingly.

 

6. Easy assembly
The property of terminal is good enough to be fixed to any equipment by soldering, inserting, riveting and gluing. Manual mistakes in traditional wiring are avoided.

 

7. Good insulation
We selected the materials with good insulation property, such as polyimide, polyester, etc. Usually, the wiring is covered, so the insulation is greatly strengthened.
FPC & FFC can be extensively applied:

 

 

Description:

 

Copper foil substrate (Copper Film) [3]
Copper foil: basically divided into two kinds of electrolytic copper and rolled copper common thickness 1oz 1/2oz and 1/3 oz
Substrate film: a common thickness of the 1mil with 1/2mil two kinds.
Glue (adhesive): thickness according to customer requirements.
Cover film protection film (Cover Film)
Cover film protection film: surface insulation. The common thickness 1mil with 1/2mil.
Glue (adhesive): thickness according to customer requirements.
Adhesive buildup of foreign matter before pressing the shape from the paper: avoid; easy job.
Stiffener (PI Stiffener Film)
Stiffener: reinforcing the mechanical strength of the FPC, to facilitate the surface mounting job. Common thickness 3mil to 9mil.
Glue (adhesive): thickness according to customer requirements.
Shape from the paper: to avoid foreign matter adhesive buildup Crimping before the.
EMI: electromagnetic shielding film, the protection circuit board line without interference from the outside world (a strong electromagnetic District or susceptible to interference zone).

 

 

Applications:

 

1.The mobile phone

Focuses on the flexible circuit board light weight and thin thickness. Can effectively save the volume of products, easy connection of the battery, microphone, and buttons and into one.

 

2.Computer and LCD screen

Use the one line configuration of flexible circuit boards, and thin thickness. The digital signal into the picture, through the LCD screen

 

3.CD player

Focuses on three dimensional assembly characteristics of flexible circuit boards and thin thickness. The huge CD to carry around

 

4.Disk drives

Regardless of the hard disk, or diskette, is very dependent on FPC high softness and thickness of the 0.1 mm slim, read data finish quickly. Either a PC or NOTEBOOK.

 

5.The latest applications

Hard disk drives (HDDS, hard disk drive) of suspended circuit (Su ensi. N cireuit) and the components of xe packaging board, etc

 

 

Specifications:

 

As per request OEM/OEM

Material: PI: 1 mil
Cu: 1 oz
PI: 1 mil
Surface treatment: pure-tin plating
Minimum hole dimension: 0.3mm
Minimum linear width: 0.08mm
Minimum linear distance: 0.08mm
External tolerance:+/-0.05mm
Welding resistance: 280 more than 10 seconds
Peeling Strength: 1.2kg/cm2
Heat resistance: -200 to +300 degrees C
Surface resistivity: 1.0 x 1011
Bandability: meet IPC standard
Chemical resistance: meet IPC standard

 

 

Competitive Advantage:

 

1.short: assemble shorter working hours

All lines in the configuration is com

Send message to this supplier
Mr. Chen
Tel: 86-769-82659918
Enter between 20 to 3,000 chatacters.
Contact Method
HuaHongChuang Membrane Products Limited
No.1 Bei an AVE,Huangjiang Town, Dongguan, Guangdong, China (Mainland)
Didn't find what you're looking for? Post Buying Lead or contact our customer service specialist for help!
Buyer Help Center