Printed Circuit Board
We can offer a full range of rigid board constructions from single / double sided up to 32 layers and beyond, with vast experience in high layer count / high technology boards.
We have continually invested not only in the equipment and processes to allow the production of these high technology boards, but also in the latest test and inspection equipment to ensure the highest quality.
Some key rigid technology features are:
High layer count multilayer
FR4 / Polyimide / High Speed / Special Materials
Micro via / Blind via / Buried via
Stacked vias
Controlled Impedance
Category | Description | Capability |
File Formats | Gerber files- preferred | 274-X,274-D,DPF,ODB++ |
Drill file | X & Y coordinates, with tool sizes included | |
Size | Max. finished dimensions | 580mm x 800mm-Single/ Double-sided |
550mm x 800mm-Multilayer | ||
Board Thickness | Standard | 1.6mm ±10% |
Min. | Single/ Double-sided:0.2mm ±0.1mm | |
4-layer:0.2mm ±0.1mm | ||
6-layer:0.4mm ±0.1mm | ||
8-Layer:0.8mm ±0.1mm | ||
10-layer:1.0mm ±0.12mm | ||
12-layer:1.2mm ±0.12mm | ||
… | ||
32-layer:4.0mm ±0.4mm and above | ||
Max. | 6.3mm ±10% | |
Bow and twist | < 7/1000 | |
Copper | Outer Cu weight | 1oz ~ 10oz |
Weight | Inner Cu wight | 1/3oz ~ 6oz |
Laminate Materials | FR4(HighTG,halogen-free),FR5,ISOLA(FR408,370HR),TEFLON,POLYIMIDE,ROGERS(RO4003,RO4350,RO4450),Aluminum plate (Single,Double-sided) | |
FR4 Thickness | 1.6mm | |
High TG FR4 (170 deg C) | 1.6mm | |
Board Cutting | Max. number of layers | 32 |
Min. thickness for inner layers (Cu thickness are excluded) | 0.07mm | |
Drilling | Min. size | 0.1mm |
Max. size | 6.0mm | |
Drill Deviation | ±0.002" (0.050mm) | |
PTH hole tolerance | ±0.003" (0.075mm) | |
NPTH hole tolerance | ±0.002" (0.050mm) | |
Angle of Countersink | 80°,90°,100°,120° | |
Plating | Min. hole size | 0.0008" |
Aspect ratio | 20 | |
Etching | Trace width tolerance | ±20% |
Min. trace width / space (1oz finished Cu weight starting from 1/3oz) | 0.003"/ 0.003"(0.08mm) | |
Min. trace width / space (1oz finished Cu weight starting from 1/2oz) | 0.004"/ 0.004"(0.1mm) | |
Min. trace width / space (2oz finished Cu weight) | 0.005"/ 0.005"(0.127mm) | |
Min. trace width / space (3oz finished Cu weight) | 0.008"/ 0.008"(0.2mm) | |
Min. trace width / space (4oz finished Cu weight) | 0.012"/ 0.012" (0.3mm) | |
Inner Layers | Min. space from drilling to inner pattern | 0.1mm |
Min. space from annular ring to inner pattern | 0.1mm | |
Layer-to-layer registration | ±0.003"(0.08mm) | |
Solder Mask | Color | green,lightgreen,mattegreen,white,extremewhite,black,matteblack,darkbrown,yellow,red,blue,transparent |
Min. solder mask clearance | 0.003" | |
Thickness | 0.0004" | |
Silkscreen | Color | White,black,yellow,red,blue,green |
Min. trace width | 0.005" | |
Min. size | 0.028" / 0.028" | |
Electrical Test | AOI | Y |
Flying Probe Tester | Y | |
Controlled Impedance | Tolerance | ±10% |
Impedance tester | Tektronix TDS8200 | |
Routing | End Mills Test | ±0.15mm(0.006") |
CNC Tolerance | ±0.15mm(0.006") | |
V-Cut Depth | ±0.1mm(0.004") | |
V-cut angle deviation | ±0.1mm(0.004") | |
Semi-hole | Y | |
Surface Finish | HASL,HASL pb free,immersion gold,immersion silver,immersion tin,O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon… | |
Blind and Buried Vias | 3+N+3 | Y |
Resin,hole-filling ink,PTH | Y | |
Others | UL Cert. | Y |
ISO Cert. | ISO9001/ISO14001/RoHS | |
