Metal Core PCB
Independent research and development of metal substrate production equipment, introduced SF shape processing technology, applied to various light bar, can improve the utilization rate of material free of mold, and improve customer productivity efficiency. Independent research and development of thermal conductivity of soft sheet material and technology can be applied to a variety of modeling of the high power lighting field.
Our COB product Has more than 5 years experience in COB product development and production experience, the only global mirror polishing technology, specular reflectivity reaches as high as 97%, line yield rate as high as 99.9% or more; otherwise the development of a number of COB process and patented technology
Feature
· Improvement in High thermal conductivity using Prepreg
· Upgrade of warp and twist problem caused by Coefficient of thermal expansion
· Excellent corrosion resistant and durability of abrasion
· Good dimensional stability
Application
· LCD, LED, BLU, Substrate for LED, Power Supply, Converter, Inverter
· Automobile igniter, Automobile Controller, Voltage Regulator Converter, Motor Driver, PDP, Audio etc.
Category | Capability | |
1 | Layers | 1-2Layer |
2 | Material Supplier | Bergquist,Laird,Sanyo,Polytronics,TOTKING,DENKA,NRK ITEQ,BOYU |
3 | Metal base type | FR-4, Al base board, CU base board |
4 | Aluminum models | 1100,3303,5052,6061 |
5 | Board Thickness | 0.5-3.2mm |
6 | Insulation layer thickness | 50-150um |
7 | Max Board Size | 1220×500mm |
8 | Heat conductivity | 1W/Mk, 2W/Mk, 3W/Mk, 4W/Mk, 8W/Mk |
9 | Electric Strength
| DC:600V/50uA or 1000V/5mA(LED) |
According to the material properties | AC:2000V/1Ma or 5000V/5mA(POWER) | |
10 | Core material thickness | Min:0.1mm |
11 | Inner line width/Space | 0.1/0.1mm |
12 | Outer line width/Space | 0.15/0.15mm |
13 | Layer to Layer Registration | ±0.05mm |
14 | Copper foil thickness | HOZ,1OZ,2OZ |
15 | Finished hole diameter | 0.55mm |
16 | Hole diameter tolerance | ±0.05mm |
17 | Hole position tolerance | ±0.075mm |
18 | Surface finish | HASL,HASL pb free,immersion gold,immersion silver,immersion tin, O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon… |
19 | Profiling | Punching, Routing, V-CUT, Beveling |
20 | Special requirements | Buried and blind vias ,controlled impedance ,BGA |
21 | minimum V-CUT Board Thickness | 0.6mm
|
22 | maximum Test Insulation Resistance
| 100MΩ
|
23 | minimum Test Conductive Resistance
| 10 Ω
|
24 | Plate shape tolerance
| ±0.10mm(4mil) |
